Electronics Forum | Wed Apr 21 11:33:20 EDT 2004 | tigerlordgm
As one of our small batch processes, we place BGAs on PCB without using solder paste. We apply tacky flux to a predetermined height on a pallet, "dip" the BGA into the tacky flux to wet the solder balls to the set height, and then use a BGA rework st
Electronics Forum | Sun Apr 18 00:26:29 EDT 1999 | Vic Lau
| | | | | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | | | | | | | I consider "fines" individual unmelted metal sph
Electronics Forum | Thu Jul 22 12:05:33 EDT 1999 | John Thorup
| | Which among the two profiling method is more reliable/accurate in getting the oven thermal profile? | | | | a) using a HIGH-TEMP solder wire then soldering the thermocouples onto the profile points of the board (e.g. component lead etc.) | | |
Electronics Forum | Tue Apr 10 17:44:13 EDT 2001 | davef
Listen, there is a $20 to 30k laseriffic paste measuring system that is not only very expensive and a major bottle neck, but its limited accuracy is the kicker that makes this little item a really special!!! [What a combination, eh???] And that doe
Electronics Forum | Wed Sep 22 21:23:03 EDT 1999 | se
| | I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | | The stencil is 6 mil thick, laser cut and electo-polished. | | The apertures are 12 mil in diameter with 20 mil pitch. | | We
Electronics Forum | Thu Sep 23 12:47:48 EDT 1999 | Earl Moon
| | | I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | | | The stencil is 6 mil thick, laser cut and electo-polished. | | | The apertures are 12 mil in diameter with 20 mil pitch.
Electronics Forum | Thu Aug 05 11:15:39 EDT 1999 | John Thorup
| | | | | | | | | Hello, | | If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same problem with chip compon
Electronics Forum | Tue Mar 17 13:11:58 EST 1998 | ETS, LLC
ETS (Energy Technology Systems) is a manufacturer of Solder Reflow and Curing Ovens for the Electronics Industry. We offer a specially configured oven designed for processing of Pin in Paste processes as well as double sided mix technology boards. I
Electronics Forum | Fri Dec 15 07:25:21 EST 2006 | kvanzill
Hello, I am seeing something new to me and I am hoping some one some where may have resolved this before. I am running a Panasonic SPF63 screen printer with Tamura (RMA-012-FPL) solder paste. Now this problem is hard to describe but I will do my bes
Electronics Forum | Fri Jun 08 09:53:23 EDT 2007 | rgduval
What is the general consensus on automated solder paste inspection? In a previous life, when we implemented AOI equipment, we implemented it at the end of the SMT line; our reasoning was that our screen printers had adequate repeatability for our pr
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