Electronics Forum | Wed Aug 24 08:37:56 EDT 2011 | bobsavenger
Just wondering what everyone is using to verifiy Wave solder pre-heat temps before the wave. Temp dots seemed to be the way in the past but I'm wondering how many are using IR temp gun and if they have noticed any differences between the temp dot an
Electronics Forum | Fri Oct 07 17:22:16 EDT 2011 | davef
Questions are: * Pressure? * Heating ramp? * Solder alloy? * Solder preform or paste reflow? [We have more, depending on your answer] * 0.5 mm is pretty tight. Talk about tooling holes and measures to prevent flexing of the assembly * In time, heat a
Electronics Forum | Tue May 22 11:38:04 EDT 2012 | naynayno
I am looking for IPC or other published standards that specify cleanliness levels for: 1) solder paste stencils 2) selective solder pallets When we cleaned PCB's we used a limit of 4 M-ohms. Now that we have transitioned to No-Clean, I am wonderi
Electronics Forum | Wed Jun 20 08:46:15 EDT 2012 | jdengler
Hello all, We have a customer requesting the use of Sn95/Sb5. Of course they are in a hurry and I have not found any in stock. I need solder paste and cored wire. We can use water soluble or low residue (no-clean) flux. Anyone have a lead on a s
Electronics Forum | Sat Aug 25 23:01:45 EDT 2012 | ssridhar
Hello jdumont, I think the spheres are leaning as there is not enough meat under the spheres. In ceramic BGA devices there is a solder fillet which is generally a solder paste which is used to give the device some height before balling it. This heig
Electronics Forum | Mon Oct 15 08:24:24 EDT 2012 | scottp
You could pay the extra to have the microvias plated shut and planarized. If your voids are larger than 25% of the BGA joint area then I would suspect a solderability problem. Either the board plating or a solder paste problem. If they're less tha
Electronics Forum | Fri Feb 08 16:21:15 EST 2013 | spitkis2
Are you doing this to minimize solder paste splattering? Is this a value that you use for all QFN's (would the overall size of a QFN matter)? I was told reducing placement force with these components is recommended so just was wondering what is bein
Electronics Forum | Fri Jun 27 13:02:28 EDT 2014 | spitkis2
Is this fluxed / solder paste or flux-less reflow process? Are you soldering in a nitrogen or vacuum oven? From my experience having gold-tin connections go through reflow a 2nd time does not yield defects or quality issues. However, I cannot comm
Electronics Forum | Thu Jan 29 15:27:54 EST 2015 | markhoch
I agree with SWAG on this. Nano Coatings make a big difference on paste release. I found when placed on the topside of the stencil, it also helps to reduce stencil wear, though others complained that it affected the solder roll, so most stencil house
Electronics Forum | Fri Jun 26 04:26:11 EDT 2015 | grahamcooper22
In the EU these companies have great equipment and experience with laser soldering systems...you have to make sure you use the correct wire / paste....Almit is the best. http://www.wolf-produktionssysteme.de/en/ http://www.mtaautomation.com/ Maybe c
