Electronics Forum | Sat Apr 14 03:34:23 EDT 2001 | kpliew
Hi Greg, If u don't mind my recommendations. U may want to try to convince them that by using smaller pad size , u save solder paste in the end of the day (provided u are doing mass volumes). It is another way of getting around to ur idea of changin
Electronics Forum | Thu Apr 19 09:37:31 EDT 2001 | marquesj
To this Guy`s Author: Michael Parker Author: Dreamsniper Caso pretendam falar a serio enviem um e-mail pessoal e deixem o forum em paz, caso contrario deixem trabalhar quem gosta. sorry, couldn't resist!!! To: Mr. Dave F Thank`s for your help.
Electronics Forum | Tue Apr 24 20:26:00 EDT 2001 | kcw
We solved similar problems some time ago. Check the volume dispensed or printed. Also check that the glue or solder paste has not expired and if in doubt use a new cartridge or change supplier. Ensure the Z axis stroke and placement force is corre
Electronics Forum | Tue Oct 24 17:01:20 EDT 2000 | Philip A. Reyes
Hi! Good day!! My questions is about PBGA rework the ff are: 1. Is it necessary to reball the plastic BGA module after removing it from the PCB? Can you give me the process and critical requirements?(e.i.stencil) 2.After removing the PBGA modul
Electronics Forum | Thu Aug 24 16:54:33 EDT 2000 | Dr. Ning-Cheng Lee
52In/48Sn solder has a melting point 118C, and can be reflow processed at temperature down to around 165-170C. The material is very soft, very low in shear strength. It is relatively ductile, can be stretched to about 2-3X of Sn63 in elongation. Amon
Electronics Forum | Thu May 03 18:40:34 EDT 2001 | pzohbon
We produce a board right now with a QFP that has 20 mil pitch and we are seeing problems with the solder deposition. I believe it to be a cleaning issue which we are addressing. Soon we will be pasting for bga's. Is there a problem with using inter
Electronics Forum | Fri Jul 06 18:21:24 EDT 2001 | davef
Maybe someone else can help, like: http://www.ceeris.com/efficiency.htm. Check with the following SMTnetters: * Steve Gregory. He posted a thread within the past week or so on solderability testing. He used to work at a memory module manufacturer
Electronics Forum | Wed Jul 11 18:32:34 EDT 2001 | Darby
Mark, We print and dispense with Amicon "D 125 F". Solvent used is Electrolube "SSS", which is also used for solder paste removal/pcb cleaning for misprints and rework both manually and ultrasonically. I like it - good stuff but at $25 AU per litre i
Electronics Forum | Mon Jul 30 21:07:35 EDT 2001 | davef
So, yer loosing parts between place and reflow? That would seem to say yer: * Paste has lost tackiness [check the fine SMTnet Archives for a sample test.]. * Really not placing the parts that you think yer placing. * Knocking the parts out of place
Electronics Forum | Thu Jan 20 23:01:19 EST 2000 | KS Wong
Larry, My lines are running ENTEK boards all the while. Currently, we used Kester R-252 solder paste. We found voids! Now we are evaluating the Alpha Metal UP78-M. I've been told that the better flux due solve the voids problem, especially whe
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