Electronics Forum | Wed Sep 08 14:31:48 EDT 1999 | John Thorup
| | Hello: | | We are using a Heller 1500S reflow oven to solder surface mount parts. Just within the last two weeks, the larger I.C.'s are moving while going through the oven. The parts are checked for placement before putting into the oven.
Electronics Forum | Mon Aug 30 04:08:51 EDT 1999 | Earl Moon
| | Planning to evaluate the above process... | | Can anyone can give me some tips/infos on the above.... | | e.g. stencil aperture design, aperture ratio, common problems and solutions they encountered on the above process, is the profile different
Electronics Forum | Wed Aug 18 12:35:41 EDT 1999 | Earl Moon
| | WE ARE CURRENTLY HAVING PROBLEMS REFLOWING BOARDS WITH WHITE TIN PLATING. WE ARE NOT GETTING GOOD WETTING ON THE PADS. | | WE HAVE CHECKED THE REFLOW PROFILE AND TRIED DIFFERENT PASTE'S. | | WE THINK THERE MAY BE CONTAMINATION OR OXIDATION ON THE
Electronics Forum | Wed Aug 18 21:25:37 EDT 1999 | Tony Yang
| WE ARE CURRENTLY HAVING PROBLEMS REFLOWING BOARDS WITH WHITE TIN PLATING. WE ARE NOT GETTING GOOD WETTING ON THE PADS. | WE HAVE CHECKED THE REFLOW PROFILE AND TRIED DIFFERENT PASTE'S. | WE THINK THERE MAY BE CONTAMINATION OR OXIDATION ON THE PADS.
Electronics Forum | Thu Aug 05 10:55:09 EDT 1999 | Wolfgang Busko
| | | | | | Hello, | If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same problem with chip components but
Electronics Forum | Thu Jul 08 12:33:52 EDT 1999 | Mike Demos
Thank you all for your replies. Thanks to your replies and backup from the IPC-SM-782A (section 3.6.3.2) and James Blankenhorn's "SMT Design Rules & Standards," the designer has agreed to provide adequate clearance between the via and the pad. I wi
Electronics Forum | Sat Jun 05 07:37:25 EDT 1999 | Dave F
| We are changing from through-hole to SMT, wondering what pitch requirements would an 8 pin SOAC require for pick and place? We think that this would be our finest pitch part. | John: Never heard of an "SOAC." SO packages are 50 ptch (50 mil, 1
Electronics Forum | Mon Jun 07 11:25:41 EDT 1999 | Brian Wycoff
| | | I have difficulty to convince my management to air-condition our manufacturing facilities. The room temperature fluxuates from 8 deg.C in the morning to 25 deg. C in the afternoon. The PCB topside temperatures in the reflow oven and wave solder
Electronics Forum | Mon Jun 07 16:52:51 EDT 1999 | Dave F
| | | | I have difficulty to convince my management to air-condition our manufacturing facilities. The room temperature fluxuates from 8 deg.C in the morning to 25 deg. C in the afternoon. The PCB topside temperatures in the reflow oven and wave sold
Electronics Forum | Fri May 28 07:37:52 EDT 1999 | Steve Cheung
Yes l know this problem keeps cropping up on the forum but l've missed some of the follow-ups. Our problem is that the lifting only occurs on 3% of production so actually detecting an improvement is difficult. We're actually having to inspect 144 p
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