Electronics Forum | Sun Sep 11 01:55:16 EDT 2005 | Mika
I forgot to mentioned, that we produce both leaded and RoHS products in the same SMT-lines. The only thing we do; is a more trouhgfully cleaning of the stencil printing machine in beween product changeover of leaded/RoHS products. Sincerly,
Electronics Forum | Thu Nov 03 20:59:33 EST 2005 | SJ
We are a small-medium size CM and are looking to convert to Lead-free. Any recommendations for good (Price, Quality, Throughput) Reflow Ovens and Wave Machines for Lead-free will be greatly appreciated!
Electronics Forum | Wed Nov 30 11:43:15 EST 2005 | russ
You will be fine as long as you don't run BGAs this way. I would imagine that you have already been doing this for some time already. You might need to increase peak temp and or time with some of the lead finishes.
Electronics Forum | Fri Dec 16 21:16:38 EST 2005 | Frank
The RoHS legislation says that it possible to have an exception from lead. That means that You are allowed to have Pb in the solder joint! While the component and the pcb must be RoHS compliant! Isn't that fun?
Electronics Forum | Mon Dec 19 17:14:16 EST 2005 | Chris
Here is a study from Motorola. Lead free is full of confusion and contradictions. This report may help. http://www.freescale.com/files/netcomm/doc/package_info/MPC8250PBFREEPKG.pdf
Electronics Forum | Thu Jan 05 17:10:04 EST 2006 | russ
The CCGA packages that we install are still a tin/lead alloy and not a SAC alloy. They were 90/10 SN/PB. I beleive that this may be one reason why the difference.
Electronics Forum | Wed Feb 01 09:44:23 EST 2006 | mmurison
See the paper presented by M Simard Normandin at the International Lead free conference in Toronto May 24th 2005 link to the paper is available on our website under the event http://www.muanalysis.com/about/events.html
Electronics Forum | Thu Dec 22 10:37:05 EST 2005 | mark
Pete is correct. Lead from the "Leaded" parts will leach into the solder pot and eventually the Pot will become contaminated with unacceptable levels of lead. At that point the entire pot will have to be emptied and cleaned. NOT a fun thing to do!!
Electronics Forum | Tue Jan 31 12:37:33 EST 2006 | carterhoward
I guess my biggest concern would be what will happen to the inner metallic layer of the leaded solder during the higher temperatures.
Electronics Forum | Tue Jan 31 12:53:50 EST 2006 | Chunks
We just did this and are awaiting the results. Solder balling and a burnt looking flux where visual indicators that we noticed running regular paste at no-lead temps.
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