Electronics Forum | Sat Feb 26 08:37:32 EST 2000 | Dave F
Sze-Pei: Your e-mail address doesn't work. Dave
Electronics Forum | Wed Jan 31 11:53:39 EST 2001 | rocky1
Looking for another source beside Omega! We buy the Omega brand 5SC-TT-K-36-36. Omega's lead-time on this stuff is 4-5 weeks. Can anyone help?
Electronics Forum | Tue Feb 06 16:13:55 EST 2001 | steves
I am looking for a mid-tier Contract Manufacturer in Brazil with SMT Assembly and Test capability. If anyone has any leads, please let me know. Flextronics, Solectron and Celestica have already declined...not enough $$ for them. Thanks Steve
Electronics Forum | Tue Feb 27 08:05:33 EST 2001 | Jim Zanolli
Teka may be able to help you with our Solder-Flux Bearing Lead Technology. Pleases contact me offline for more information. phone: 401-785-4110 e-mail: zanolli@tekais.com
Electronics Forum | Mon Mar 19 11:26:21 EST 2001 | Steve
Another issue is that once solder paste has been reflowed, the majority of the flux is gone. If it is reflowed again without solder flux, the risk of introducing oxidation to the component leads is increased, thus creating a weak solder joint.
Electronics Forum | Thu Mar 22 21:53:49 EST 2001 | davef
Don't mess with the doggie stuff until you get longer pads [and then you won't have to mess with it] because you'll just ruin your lead definition with more paste and still not have the heel fillet you desire.
Electronics Forum | Wed Mar 28 10:56:56 EST 2001 | jseagle
Does anyone know the formula for calculating the grams per sq cm of lead for mounting bottomside unglued components? Thanks James
Electronics Forum | Thu Apr 05 13:54:18 EDT 2001 | CAL
Do the parts sit directly on the PCB? Typical 2.0 mm Max is desired for the component to be off the PCB. Are stand-offs an option? The long lead wiggles as it passes through the wave and thus agitating the air out.Does your wave a "dancer" option?
Electronics Forum | Thu Aug 24 13:21:57 EDT 2000 | Dave F
Please compare indium (In) / Tin (Sn) paste properties in terms of reflow profile, creep, grain structure, etc with other major no-lead solder formulations.
Electronics Forum | Tue Aug 22 09:30:18 EDT 2000 | gdiepstraten
With the introduction of new lead-free alloys and higher temperatures to meet their specifications, can we expect different and/or more residues in the reflow soldering process?
