Electronics Forum | Mon Apr 19 02:45:31 EDT 1999 | Brian Sloth Bentzen
| | We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have t
Electronics Forum | Wed Apr 07 16:23:01 EDT 1999 | GREG DENHAM
DOES ANY ONE KNOW HOW I CAN STRAIGHTEN BENT PINS ON A FINE PITCH QFP WITH OUT DAMAGING THE CHIP. AT $300 A CHIP I CAN'T SCRAP THEM.
Electronics Forum | Mon Mar 01 12:50:47 EST 1999 | justin medernach
| Hello! SMT professionals, | | I do not know if anyone posted this question before. | Last week, I reflowed our newly designed thin Rigid-Flex pcb with 0.040" thickness. I found all of pins of a TQFP48 ic did not get wetted. I could see on the hee
Electronics Forum | Thu Feb 04 06:50:35 EST 1999 | Greg Flynn
What allowances are people using out there for components off-pad, we currently use 50% of lead width without breaking trace/component clearances but we have a customer demanding 25% allowance ?
Electronics Forum | Thu Feb 04 09:09:11 EST 1999 | Peet
| What allowances are people using out there for components off-pad, we currently use 50% of lead width without breaking trace/component clearances but we have a customer demanding 25% allowance ? | We use 50% for civile application, and 25% for mil
Electronics Forum | Thu Jan 14 23:49:00 EST 1999 | Wirat Sriamonkitkul
I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? Thank you, Wirat S. / Jan 15
Electronics Forum | Sat Jan 09 12:12:21 EST 1999 | Jim Schultz
I need leads on equipment vendors for selective soldering systems. I have information about ERSA and Seho already. I want to contact Air Vac in particular, but I can't find thier phone number. Thanks for the help
Electronics Forum | Fri Jan 08 02:27:00 EST 1999 | Kwang-Seong Choi
HI! I am a package engineer in Korea. I have some reasons to desolder excessive solder at the lead of TSOP and TSOJ after removing them from the board. The way with solder wick is too time-consuming and depends on the operator. Does anyone know the
Electronics Forum | Tue Jan 05 18:07:53 EST 1999 | Dave F
| I am looking for information regarding post wave soldering of stranded wires into a circuit board using OA core wire solder. We do a final pass thru the cleaner after the hand soldering but I'm concerned about any OA flux residue that may have wic
Electronics Forum | Mon Dec 28 17:37:18 EST 1998 | Joann Moore
I am looking for a questionaire/list of items that need to be addressed to determine the pros/cons and equipment, manpower, cost and lead time to determine if one should consider setting up an in-house SMT line. Can anyone help? thanks
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