Electronics Forum: lead (Page 646 of 789)

DPMO calc and Overall Manufacturing Index (OMI) calculations

Electronics Forum | Tue Sep 04 13:41:52 EDT 2001 | Brian W.

IPC7912 deals with the end result, ie an OEM getting boards from a contract manufacturer. I have a friend who is sitting on these committees. He tells me there is a new standard due out for actually doing in-process DPMO. From a process standpoint

15mil on a Contact 3AV

Electronics Forum | Thu Aug 30 14:14:27 EDT 2001 | dougt

James Take a board with double sided tape and run it with all the other parts "shorted". Make sure that the part is being placed by the head/spindle that will be used during a full run. Inspect the part after it is placed and carefully remove it a

Board support issues

Electronics Forum | Tue Sep 18 13:58:01 EDT 2001 | ert002

50%) only over the appertures where there was poor support. Most prints took 2 knead strokes to print OK, but this caused fine pitch leaded devices to almost short. stencil had to be be wiped after kneading. 2 similar devices with exactly the same

Through-hole/SM mix

Electronics Forum | Mon Oct 15 10:57:32 EDT 2001 | davef

Before this wave solder pallet salesman blather gets too far out-of-control, let�s stop for a minute. The three major approaches you have are: 1 SELECTIVE SOLDERING: Using: * Specialty wave soldering machine to solder specific areas of a board * P

Product Changeover (SMT double sided)

Electronics Forum | Fri Oct 26 11:37:27 EDT 2001 | Dave G

You could start by putting together a matrix of P/N's vs product. This will tell you which parts are common with most of your jobs. These would then become part of a fixed feeder setup that would stay on the machine. (These will probably be mostly R'

BGA,s Storage

Electronics Forum | Tue Nov 13 11:22:50 EST 2001 | fmonette

Dave, Hany, I was actually surprised to hear that topside SMT components can reach such a high temperature during wave soldering. If this is the case then the concern for component damage is very valid. This morning I discussed this issue with Jac

Screen Printing Adhesive on Mixed Technology Boards

Electronics Forum | Mon Nov 26 15:30:35 EST 2001 | jhingtgen

To all, For the benefit of everyone there will be a session conducted at APEX on this topic. I have included the information that I pasted from the APEX website (http://www.goapex.org). ADHESIVE PRINTING Chris Marinelli, Loctite Tuesday, Janua

Heller 1088 Reflow Oven Conveyor Adjust

Electronics Forum | Tue Dec 18 18:37:35 EST 2001 | Dreamsniper

Hi, Forgive me for my stupidity. Has anyone moved the fixed side of the Heller's Edge hold conveyor by 50mm ? I need infos on how they did it. This is because of the high delta T that we are getting from our oven which is between 20 to 20 deg. C from

Wave Soldering and Through Hole Forums

Electronics Forum | Thu Jan 24 09:53:56 EST 2002 | davef

You didn�t tell us about your solder, wave temperature profile, or the distribution of the problem. So, let�s assume the solder is near eutectic and the problem is wide spread. Wolfgang makes good points. So, let's talk a different tact. When we

AOI ( automated optical inspection) benchmark

Electronics Forum | Mon Feb 18 17:27:03 EST 2002 | hgwells

Agilent has a great article on determining whether automated optical inspection (AOI) or automated x-ray inspection (AXI) is right for you. It's a PDF file that can found here: http://www.ate.agilent.com/EMT/LIBRARY/X-RAY/DOCS/59883661en.pdf To sum


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