Electronics Forum: lead and component and testing (Page 1 of 24)

ICT and specifying PCBA testing

Electronics Forum | Fri Mar 26 11:31:34 EDT 2010 | rway

I have been using ICT for a number of years. It is still a viable resource for catching defects in the production process. AOI doesn't catch everything, such as bridging on QFN or J-lead devices (this will depend on the type of AOI and camera syste

lead free platings and tin lead

Electronics Forum | Tue Aug 31 21:45:49 EDT 2004 | KEN

I have experienced this directly in SMT and wave solder. Fillet lift (can) be a direct indicator to lead enrichment (but its not the exclusive symptom). Lead enrichment in smt joints reduces the interfacial strength shortening the time to creep f

ICT and specifying PCBA testing

Electronics Forum | Mon Mar 29 12:10:14 EDT 2010 | rway

Test Jet will work for catching lifted leads, certainly. X-ray is the only thing for testing for internal solder defects such as voids and cracks. I personally do not have any experience using X-ray, so I cannot advise on its reliability. Perhaps

ICT and specifying PCBA testing

Electronics Forum | Thu Mar 25 12:24:12 EDT 2010 | ssager

When testing components on a PCBA, try to validate coverage for presence, correct, orientation, live, and alignment. AOI is not really great at catching cold solder joints and damaged components, and from my experience an X-Ray is only as good as the

ICT and specifying PCBA testing

Electronics Forum | Fri Nov 18 12:35:15 EST 2011 | rway

As the article eludes to, you still need probe access to measure the pins with TestJet. One thing I wanted to add was the use of JTAG for use with Boundary Scan. Certain devices have JTAG capability, but not all JTAG devices are Boundary Scan compa

ICT and specifying PCBA testing

Electronics Forum | Tue Nov 01 14:46:31 EDT 2011 | davef

Agilent TestJet Technology White Paper In the early 1990s, the testing of digital parts became problematical. Previous in-circuit test techniques sought to ensure a correct, functioning part by applying digital patterns, called vectors, to the input

assembly cleanliness and ionic testing

Electronics Forum | Fri Feb 13 16:13:20 EST 2009 | jax

Many shops require levels for typical component packages on FR-4 or a like substrate to be 2, 9, 15, 1 and 10 mg/in2 for fluoride, chloride, bromide, nitrate, and sulfate respectively. These levels can change for Medical or Automotive.

ICT and specifying PCBA testing

Electronics Forum | Tue Mar 23 07:35:42 EDT 2010 | jooh

Since I'm new to the forum I probably ask previously answered questions (that I have not found) but I would be grateful if someone could clarify this for me. I'm in R&D at a company where we design low volume (1k-10k) fairly complex PCBAs for our pr

Re: Ionic testing and No-Clean flux

Electronics Forum | Sat Feb 05 09:08:18 EST 2000 | Dave F

Casimir: Let me expand on something that I said in my response to your thread on ionic testing. Generally, no-clean people don�t use ROSE testing as part of their process control, because the ROSE test is essentially washing your board in DI/IPA �

Adhesive Spray for testing and trim P&P

Electronics Forum | Mon May 14 09:35:21 EDT 2018 | directx995

Hello everyone, A few days ago I design one special kind of PCB for testing accuracy of our Pick and Place machines. (for trimming, calibrating, NPI etc.) I am looking for adhesive spray, to apply it on PCB (at the moment I'm using double sided tape

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