Electronics Forum | Tue May 06 11:56:56 EDT 2008 | joeherz
We have a board that uses 0402x4 RNET packages that we are having a difficult time getting to solder consistently. Paste deposition is fine (using AIM WS353) and profile is dead-nuts. I'm starting to wonder if this is something that we're just goin
Electronics Forum | Thu Jun 19 12:27:14 EDT 2008 | guqing
Thanks CK. You are right the 200C constraint is absurd, but it's the reality, and the worst is this kind of components will go through lead-free profile. Do you or any body here experiencing the same problem? any body using Vapor phase and having suc
Electronics Forum | Thu Jun 19 15:52:16 EDT 2008 | guqing
So correct me if I'm wrong: you are using a conventional oven (not VP, otherwise you must have mentioned), your big electrolytic caps go through a lead-free profile, which requires 30sec minimum at 230, but your time above 200C on the caps is less th
Electronics Forum | Mon Jul 28 16:48:54 EDT 2008 | pcbbuilders
my oven has a built in profiler, it works fairly well, but it can not predict changes. my main concern was about the time right before reflow. i know that's where the flux is activated and i was worried that i may be spending too much time at the tem
Electronics Forum | Fri Aug 01 21:10:35 EDT 2008 | leo_dektec
You can keep only the 5th zone as the reflow zone. And lower the first two zones to keep a good ramping rate. Meanwhile,please note the ting temperature in software or control panel is not the exact temperature in your PCB, you'd better get a KIC or
Electronics Forum | Wed Aug 06 09:32:46 EDT 2008 | grics
We have a 3/6 Nozzle We do have monitors. One of our pots is leaded, the other is lead free. Our average wave height is ussually around 50%. Also, do you have any or found any benefits to removing nozzels at the end of your shift. I recall you say
Electronics Forum | Mon Aug 11 10:45:04 EDT 2008 | eyalg
I assume you mean the balls of the BGA, not pads > (laugh it up guys - I said balls). If so, you > may have a no-lead BGA or a high temp BGA. hi I mean that the the balls were left on the board and the BGA pads were found clean. What do you
Electronics Forum | Wed Aug 27 11:09:55 EDT 2008 | fede
I�m interested in the F1 model, due to the possibility of this system to be configured with 1 top camera and 4 side. We are manufacturing 0402 and 0.4mm fine pitch Lead Free, and our PCB�s quality is not very good. With just one camera are you able t
Electronics Forum | Fri Aug 29 07:22:05 EDT 2008 | realchunks
Omid, Try changing your profile. I had the exact same thing happen to me in 2006. Eventually I had to change my paste. No lead parts can and DO have a different finish that Pb parts. Why do you think the rest of the world increased their oven te
Electronics Forum | Tue Sep 16 16:30:49 EDT 2008 | ck_the_flip
Vlad, yes, he made no mention of a BGA, but I thought I'd just throw it in there. Many people are concerned with the "backward compatible" scenario - running RoHS parts with a Sn/Pb solder paste. The scenario's a no-brainer with most components, bu
