Electronics Forum | Thu May 24 01:46:45 EDT 2018 | wchen930
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Electronics Forum | Fri Apr 10 12:44:58 EDT 2015 | bandjwet
Does anyone have a clue as to why lead times are running 4-6 weeks on re-tinning of components? Is there a new spec (besides the JSTD-001F) that is causing for this rush towards re-tinning of components?
Electronics Forum | Fri Jun 12 07:14:36 EDT 2015 | gabinocf
Thanks by your response, at this moment I have problems in a Lead Free process the issues that i have are solder peaks, by my understanding this conditions is due to lack of flux, bad temperature profile or the dwell time is too long. My concern is,
Electronics Forum | Wed Oct 07 11:42:02 EDT 2015 | davef
IPC2221 Generic Standard on Board Design talks about parts weighing 5 gm or more per lead shall be supported. And goes into detail that you can find there. I image much of the requirement for staking has to do with: * Weight of the component * Servi
Electronics Forum | Fri Nov 06 15:42:58 EST 2015 | sdmideas
I am having a darn hard time getting my upward vision to successfully inspect a ssop14 package. I have created a part profile as defined by the manual as I understand. I believe the profile is ok based on comparison to like parts referenced in the q
Electronics Forum | Wed Dec 06 02:05:55 EST 2017 | jainsonsindia
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Electronics Forum | Wed Jan 13 12:33:15 EST 2016 | trampacorp
Baking it's key for success on this task. Water evaporates @ 100 deg. C. Use that temperature, or higher, for that process and your problems or concerns can be taken care of. Be wise on your cleaning process, otherwise this could lead to failures too
Electronics Forum | Fri Feb 26 17:31:02 EST 2016 | caurbach
Rob, Have you considered doing multiple dips to build the coating thickness up to what your customer thinks is good? We've done this on a small handful of products for several years. Extends your lead time, but it doesn't need to fully cure betwee
Electronics Forum | Fri Mar 11 04:12:28 EST 2016 | grahamcooper22
Please can any users of the Rheopump or Enclosed Print Head unit tell me what cartridge pressure setting they use when using lead free paste....many thanks Graham
Electronics Forum | Wed Apr 13 17:19:44 EDT 2016 | davef
Formation and Growth of Intermetallics at the Interface Between Lead-free Solders and Copper Substrates [ http://www.boulder.nist.gov/div853/Publication%20files/NIST_Apex94_Siewert.pdf ]
