Electronics Forum | Sun Sep 17 09:02:53 EDT 2006 | davef
Just as you will not find such a specification for SnPb solder, you will not find such a standard for SAC. We talked about solder strength several times previously here on SMTnet. Search the fine Archives for others comments. For instance: http://
Electronics Forum | Mon Sep 25 23:09:24 EDT 2006 | Chris G
I would suggest an Electrovert EPK Plus. It is cheap, easy to maintain, and Electrovert provides good support. You can get a refurbished lead free EPK for less than 50k. They usually come with USI spray fluxers, which is a pretty good thing, and c
Electronics Forum | Tue Sep 26 12:01:30 EDT 2006 | sliebl
We have solved our MCSB problems by using standard homeplate designs on all of our resistors and caps. I use a 50% taper and have achieved great results with 0402-1206 parts using both tin/lead and SAC305 paste. We use Amtech paste.
Electronics Forum | Wed Oct 04 14:14:49 EDT 2006 | russ
Change mfgrs of paste OR better yet use pbfree paste, If you are collapsing the balls on the BGA then you are possibly overheating the paste/flux quite a bit. most lead pastes do not like much more than 230 C. I am assuming that you have a decent p
Electronics Forum | Fri Oct 06 04:23:06 EDT 2006 | David
What is the solder finish of the board?. If this is gold, maybe you should check the reflow profile and max temperature which can easely kill your gold coating so problems with bonding. Also we are using Prozone Multicore with ultrasonic to clean
Electronics Forum | Thu Oct 05 11:37:15 EDT 2006 | russ
with this design you will have voids, you cannot trap the gas inside of via it has to go somewhere. These vias should be relieved from pad to prevent the scavenging of the paste during reflow. You may try a thicker stencil if you can to allow for t
Electronics Forum | Sun Oct 29 22:41:29 EST 2006 | hanocete
We have a current problem on our packages after we bake it for 24 hrs prior BGA rework. Flux or white residues found on the connector leads and terminals that cause not contact problems during mating. Could you help us how to clean the fluxes properl
Electronics Forum | Wed Nov 01 07:41:39 EST 2006 | billyd
I'm reworking lead free BGAs now, on a Conceptronics Freedom 3000. I use flux only (no-clean, Indium) all the time, with no issues. If you go to paste, you also understand that you still have to hit the same temperatures as with flux, as the solder i
Electronics Forum | Thu Nov 02 18:13:22 EST 2006 | russ
WE are also going through tips left and right as well with the lead free, thats why it is so environmently friendly you know!!! 10 times the amount of tips now going into trash!! okay back on track here you may wantto try some of the other MFGRS
Electronics Forum | Tue Nov 07 14:34:04 EST 2006 | jeffm
We are using Kester Type R520A, Alloy SN96.5/A63.0/CU.5 paste which is applied using an MPM Accuflex machine. Our plant Humidity is 38 degrees. We are seeing insufficient paste post stencil on fine pitch parts. Could this be an environment issue? In
