Electronics Forum: leaded (Page 471 of 790)

QFN Recognotion Problem

Electronics Forum | Tue Apr 03 08:53:07 EDT 2007 | namruht

Thanks for the help everyone. I think that the pattern instead of a leaded component is going to have the best results. Also I checked on the software update and there is not any component database differences between the newest and my current versio

90/10 & Lead Free Solder Balls

Electronics Forum | Mon Mar 26 10:40:14 EDT 2007 | solderiron

WaveroomPlus can offer the following Sn95.5 Ag3 Cu0.7 Sn95.5 Ag4 Cu0.5 Sn96.5 Ag3.0 Cu0.5 Sn97 Ag2.5 Cu0.5 Steve@waveroomplus.com

top side remelt?

Electronics Forum | Tue Mar 27 06:37:14 EDT 2007 | realchunks

There is no "standard" or "procedure". Your customer is putting a requirement on you because this has probably lead to weak QFP solder joints breaking in the field or non-functioning units due to co-planar QFP legs. I�ve been there done that. Had

soldering robot

Electronics Forum | Fri Apr 13 10:13:31 EDT 2007 | stockley

Lozie We built our own soldering robot using pace soldering irons but we have considered a Apollo Seiko bot for a different facility. I'm curious to know what kind of life you get out of those Apollo Seiko irons with lead-free solder. How many solde

Leadfree assembly

Electronics Forum | Thu Apr 12 08:48:35 EDT 2007 | stepheniii

It depends on the contract. Is it they build what they are told to build or they are saying they are building leadfree. And it's not the assembly or the part that has to be leadfree. It's the parts of the parts that have to be less than the given p

Heel bend wetting for Gull Wing lead

Electronics Forum | Wed Apr 11 20:49:39 EDT 2007 | raychamp007

3W. Figure 8-84 shown evidence of heel bend wetting(but no written criteria mention about the solder fillet must present at the heel bend). It is acceptable if the minimum D(3W/75%L)extend from toe which is no evidence of solder fillet at heel bend?

Heel bend wetting for Gull Wing lead

Electronics Forum | Thu Apr 12 20:32:31 EDT 2007 | davef

On one hand, nothing in 8.2.5.4 that states that you need a heel fillet. It only talks to the length of the side fillet. On the other hand, we suggest that you should use 8.2.5.6 to determine if your heel fillet is acceptable, after you have determ

0402 aperture design lf

Electronics Forum | Tue Apr 24 02:56:12 EDT 2007 | chrispy1963

If the PCB you are using is a HASL pad finish and is a leaded assembly, we use homeplate pads with a 5 mil stencil. If the circuit has Enig finish and is PB-Free then we use 1:1 apertures with a 5 mil stencil Either method should provide no solde

Sn63Pb37 on RoHS compliant PWB

Electronics Forum | Thu Apr 12 17:34:05 EDT 2007 | carsan

We are running RoHS compliant & non RoHS compliant assemblies. We buy our bare boards from one supplier that only manufactures RoHS compliant boards using a Sn100 finish. Is there any known issues running leaded solder on a Tin finish? Does normal

IPC Conference Raises New Lead-free Reliability Concerns

Electronics Forum | Wed Apr 18 08:44:15 EDT 2007 | pjc

Every failure analysis study I've seen, (and quite a few by now) showes Pb Free failing in about half the time or cycles as Sn/Pb. HALT and HASS testing shows reality- run way from a Pb Free product other than a camcorder, etc...


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