Electronics Forum | Thu May 06 09:24:06 EDT 1999 | Joe Manzur
Kevin, We are also looking at printing adhesive. Our application involves printing glue on the underside of the board, once it has gone through the dip, axial & radial process. In otherwords, there are leads cut and clinched and we have to mill out
Electronics Forum | Thu Oct 22 14:39:22 EDT 1998 | Chrys
| My company is looking for higher density for card layout. One suggestion has been locating active components packaged in SOT's and SOIC's on the B-side of the card. This in turn will require wave soldering of the above mentioned components. When I
Electronics Forum | Wed May 27 13:42:08 EDT 1998 | Chrys
| R&D is currently designing a board with smt components on both sides of the board. They are adding a 16 pin IC Gull wing. on the bottom side of the board. I have asked for only caps and resistors to be placed on the bottom side. Is there a recommen
Electronics Forum | Wed May 27 14:35:52 EDT 1998 | Justin Medernach
| | R&D is currently designing a board with smt components on both sides of the board. They are adding a 16 pin IC Gull wing. on the bottom side of the board. I have asked for only caps and resistors to be placed on the bottom side. Is there a recomm
Electronics Forum | Wed Aug 15 16:04:23 EDT 2001 | davef
First, responding to your question � Several things on copper dissolution in solder are: * A 50um copper wire will dissolve in 60Sn / 40Pb solder at: - 200�C solder in 55 seconds; - 250�C solder in 20 seconds; - 300�C solder in 5 seconds; - 350�C so
Electronics Forum | Mon Apr 01 19:57:07 EST 2002 | davef
Selective soldering machines are a good way to "finish automation", if the design of the PCB is conducive to the application with just a few components to solder. Your points are good. A decision matrix for selecting a machine might also include:
Electronics Forum | Sun Aug 18 06:23:34 EDT 2002 | bentzen
Hi Ken. It's always fun and a good exercise to debat on a interesting subject like this. I can see at your response that I have to clarify some of the issues. Yes, the placement machine should be the line bottleneck. And in a line with more placem
Electronics Forum | Wed Jul 02 13:26:50 EDT 2003 | Terry Saunders
Hi, Terry!� Espi on our staff passed on your request to me.� I have attached a list of companies that offer previously used equipment.� You may want to try one of them.� You can also post this question on our Web site at http://www.smta.org.� Click o
Electronics Forum | Thu Nov 13 17:18:11 EST 2003 | davef
First, don�t get distracted by �OA� and �NC� formulations. This is nomenclature. We want to discuss the issue of �activity�. J-STD-004 "Requirements for Soldering Fluxes" classifies fluxes by their chemical composition, activity level and halide c
Electronics Forum | Wed Jul 20 12:48:50 EDT 2005 | danhui888
Dear All, I'm looking for the complete SMT > equiment line (solder printer, P&P, Reflow) uses > for the small volume production line. I happen to > know that Manncorp and APSGold can provide the > complete ST line, but I haven't hear and use > t
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