Electronics Forum | Fri Sep 08 09:10:32 EDT 2006 | Claude_Couture
Hello all, The situation: We recently had 2 brand new solder wave installed, one after the other. On the first one, the "protective coating" on the solder pot started to flake off 1 day after start-up. The tech who did the installation witnessed it a
Electronics Forum | Wed Sep 13 13:35:06 EDT 2006 | Mitch Crumbstein
It took me awhile to "warm up" to KIC 2000 as well, as I, too, am an old lead-head from way back who used to profile with an old MOLE that used DOS-based software. I've also used the old SlimKIC II and Datapaq as well. I guess what he meant by "old
Electronics Forum | Tue Oct 03 17:04:07 EDT 2006 | cuculi54986@yahoo.com
Glenn, What alloy are you using for Pb-free HASL? You say tin copper nickel, but is it SN100C? Against manufacturing engineering's recommendation, my company specified simply "Pb-free HASL" as the finish for our Pb-free PCBs. One of our suppliers
Electronics Forum | Mon Nov 20 13:35:52 EST 2006 | cuculi54986@yahoo.com
We evaluated the OM338 from Alpha and it worked great! Looked like crap, though, compared to the other products out there. When I set the boards out in front of the Alpha sales guy to show him the difference in appearance between his boards and the
Electronics Forum | Tue Nov 28 08:12:47 EST 2006 | grantp
Hi, I have seen some made in China stuff, and it's well built. I don't know why a few people criticize the China made stuff, as they are working hard to make better product. I think the bigger crime is good brands that get so caught up in the corpo
Electronics Forum | Thu Nov 30 16:10:05 EST 2006 | Hussman
Wow, why all the anger? This gap you guys are talking about is measured as "G" in IPC/EIA J-STD-001 (Chunks was there, but she failed to read the fine print). And almost all parts that measure G follow Note 3 which states "Properly wetted fillet s
Electronics Forum | Tue Nov 28 21:16:17 EST 2006 | davef
J Rose at EMPF says: The introduction of no-clean solder fluxes in electronics manufacturing has given rise to greater levels of solder balling simply because the opportunity to remove them in the wash process does not exist. They are typically cause
Electronics Forum | Wed Nov 29 00:43:45 EST 2006 | callckq
Dear all, Recently, we run 2 models with heat sink attachment on top of this BGA(on top of this BGA, there is flip chip attached at the center of the BGA). Hence, the center of the BGA is higher than corner/side. We used conventional way to attach
Electronics Forum | Thu Dec 07 18:41:27 EST 2006 | GS
RoHS, or better Lead Free is an EU Directive that has been pushed ahead and driven by opportunistic lobbies ( equipment, materials, componentes,logistics, analysis labs, consultants, etc). Over here, in Eurolandia, since 2001 (the smartest started
Electronics Forum | Sat Dec 30 19:02:19 EST 2006 | mika
This type of component packages works best with vision type: 254 - irregular. Measure the total package length including the leads. Also set the body dimension x-y tolerances to at least 0.35mm and the the pick up x-y tolerences to 0.5mm in the part
