Electronics Forum | Wed Feb 25 11:37:01 EST 2015 | jasonnova
We have a customer with an assembly that will require potting using 3M DP-270. There is a component that needs to be covered with potting material but it is considerably higher than the overall potting height of the cavity. The low viscosity of the
Electronics Forum | Wed Mar 04 11:20:19 EST 2015 | jorge_quijano
Hola, I'm about to evaluate our BGA capabilities by using a dummy PCB+Components kit, I'll be evaluating solder paste, pick n place, reflow process & rework method. I have an idea of how to validate these processes. I'm planning to send different sa
Electronics Forum | Fri Mar 20 07:42:44 EDT 2015 | eezday
Dendrite growth is not typically associated with a flux reation but rather is a result of mechanical stress. The stress can be from any source including stress induced by other components, environment, plating or even bimetallics. Dendrites are most
Electronics Forum | Mon Apr 06 09:04:31 EDT 2015 | jesseoliveira
Hi all! I work in FA Lab on Brazil. Recently we had a problem with a dye pry analysis of BGA component due to breakage of WLP package (wafer level packaging). In this case, WLP thickness is about 0.28mm and was damaged during pullout process. Our
Electronics Forum | Mon Apr 27 11:29:06 EDT 2015 | chris_jayconsystems_com
When I do the adjust to make sure the vision and tolerance is working it works perfectly. But if the machine runs a board I am riddled with this. I have checked the vacuum levels on all the heads and they are within where they are supposed to be for
Electronics Forum | Fri Jun 26 10:33:08 EDT 2015 | Asif
Hello Professionals, Good morning, We are circuit card manufacturer for the Aerospace industry with low volume and High mix level. We have a plan to Purchase a NEW REFLOW OVEN. Currently we are using Electrovert BRAVO reflow oven which is about 8 yea
Electronics Forum | Sat Jan 23 00:20:22 EST 2016 | jlawson
Program conversion bewteen the two can be done , with a custom program. Issue is at what value as most simple conversions will be file based - and placement level NC data only. Part Shapes are where all the work is and if you want to convert part l
Electronics Forum | Fri Jul 29 02:50:18 EDT 2016 | pavel_murtishev
Hello, Could you please tell me what the latest Siemens F5HM software version is? Installed version we have is 407.03. It seems this software version does not support placement force adjustment for pick&place head that might be a critical point for
Electronics Forum | Fri Dec 09 00:19:51 EST 2016 | aqueous
Hi Dean, We are a manufacturer of cleaning equipment. I'm not sure if your machine is one of ours or another brand. Regardless, I am happy to provide assistance. In order to maximize the level of "helpfulness", it would be helpful for me to know mor
Electronics Forum | Sun Feb 05 03:54:06 EST 2017 | rezaee
Hi If I want to build this board :( http://wiki.friendlyarm.com/wiki/ima...-Schematic.pdf ) in large number, I like to know: 1-What should be the minimum level(number) of production? 2-How much it costs to buy the PCB product line for that purpose(Mu
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