Electronics Forum: level (Page 186 of 232)

White Flux Stains - stubborn stains

Electronics Forum | Sat Jan 19 02:25:37 EST 2002 | ianchan

Hi, Have a board run, using 63/37 Water Souble (WS) process. during the reflow setup time, we had unsolder issues on a leadless bump chip carrier (BCC) IC level package. To rectify the unsolder rejects, we adjusted the reflow time from 25-55sec into

lead substrate materials

Electronics Forum | Tue Jan 29 20:14:54 EST 2002 | davef

Please help us understand your situation better by describing the following: * Component [ie, PTH/SMT, type of component, lead finish you expected/ received, etc.] * Board type [ie, type of board FR-4/CEM/ceramic, etc.] * Solderability protection on

BGA Straight crack

Electronics Forum | Fri Feb 22 08:26:51 EST 2002 | davef

You are correct. The gold dissolves in the solder. The gold is meant to protect the nickel from oxidizing, so that you can solder to the nickel. Obviously that didn�t work as planned. Your background information is very sparse. Two things come

Solder Paste Inspection System.

Electronics Forum | Wed Mar 06 17:15:06 EST 2002 | djarvis

Hmmmm, very good point. I never thought about it much as such dedicated tools were not available when I first kicked off. I'd look at the reflow under a microscope and if I could identify any problems, I'd start to look at the print using the same

omega meter

Electronics Forum | Wed Mar 06 21:16:17 EST 2002 | davef

�What does 5 micrograms of chloride mean to me?� * With SIR testing, you can show no detrimental leakage currents under humid conditions, no corrosion, no metal migration, which are the big factors in figuring out electrochemical reliability. People

Wave Soldering with or w/o Nitrogen

Electronics Forum | Tue Mar 12 22:27:50 EST 2002 | davef

I'd speculate that the properties of a well formed solder connection processed in air and N2 are indistinguishable. Then again, the pitch is that N2 gives a wider process window, especially for NC flux-types. In the SMTnet Library look for: �Opti

Process control, SMT inspection and rework

Electronics Forum | Tue Apr 09 16:25:28 EDT 2002 | clarkk

Alan, You're right, mass inspection after assembly won't work. The inspectors will miss 25% (or more) of the defects, and the boards will be reworked before SMT operators can properly define defects and their sources. The company I work for tends to

Board in/out sensors on reflow machines, do they work well?

Electronics Forum | Tue Apr 16 13:59:33 EDT 2002 | paulausten

They work great as long as your conveyor speed > has been calibrated and checked on some type of > PM schedule. On some oven types these sensors can > warn you to possible problems with the conveyor > speed. Say the oven is calculating that the b

Bad Buisness

Electronics Forum | Tue Apr 23 14:18:19 EDT 2002 | Ken Bliss

This is quite a list of frustration. Several asked if management is listening. We make carts to suport those machines you are complaining about service. Here is one senior managers view. There is no low level people in an organization that is man

White residues

Electronics Forum | Mon Apr 22 20:55:00 EDT 2002 | ianchan

Hi, this is not really a technical solution, just a feedback. we too have a model series using the same WS paste type. it gives a dull solder joint with white residue that can be marginally removed after post-DI water rinse (ie. not 100% removed).


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