Electronics Forum | Thu Nov 01 10:57:34 EDT 2012 | kris1128
Has anyone heard whether the elevation of a plant can effect solder joint formation? One plant at sea level, one at 7,000 feet elevation... same equipment and profiles, big voiding defects at higher elevation. I did a search and found no similar post
Electronics Forum | Wed Dec 12 20:28:29 EST 2012 | davef
OSHA regulates eye protection under 29 CFR 1910.132 I've had inspectors confirm that eye protection was ANSI Z87.1 compliant, but have never had anyone question the level of protection provided by side shields.
Electronics Forum | Fri Feb 08 15:23:53 EST 2013 | spitkis2
Anyone know the placement force value (in lbs, kg, or N) on your PnP equipment when placing QFN or Wafer Level CSP's? Is this a parameter you would program for an individual component that is determined to be sensitive / fragile or do you use the
Electronics Forum | Fri Apr 26 16:26:55 EDT 2013 | emeto
Hi, thanks for your answer. I was thinking to go even deeper by counting the hours the paste was exposed, but it probably doesn't make a lot of sense, especially considering the fact that my operators will add paste when the level goes too low. I wi
Electronics Forum | Thu Apr 18 14:09:57 EDT 2013 | bobpan
Just because a feeder has 8 pins on the front does NOT mean it is IQ. The IQ feeders started at a certain level of feeder part number.....which i do not remember being that many people dont use the IQ system. Good Luck
Electronics Forum | Wed May 08 05:13:37 EDT 2013 | bobpan
Put up an e-mail address and i can send you a paper on setting up the current level to see if the board is working properly. The z-axis and theta-axis are swappable.....you just need to change the dip switch settings.
Electronics Forum | Mon Jul 15 15:02:55 EDT 2013 | island2013
In previous lives we vacuum sealed all MSD devices. Also a nitrogen chamber can be used for unsealed bags. You can check the J-STD-033 and J-STD-020A for handling of the different levels, bake times etc. Good Luck!
Electronics Forum | Tue Oct 15 11:38:47 EDT 2013 | capse
Another benefit to low O2 levels with Pb Free is increased mobility of the alloy during soldering. It is an effective mobility enhancement in reflow as in wave soldering.
Electronics Forum | Mon Nov 04 14:38:00 EST 2013 | andrew_11
My experience has been with yestech and mirtec.. When we compared the two mirtec won by finding more defects.. Vitrox which was formerly agilent was more difficult to program, and as a result required a higher level person to run it. We excluded the
Electronics Forum | Tue Jan 07 23:38:08 EST 2014 | m_imtiaz
want to know the tolerance the paste height in the solder paste printing. for example if stencil thickness is 7 mil, what will the acceptance level of paste height ( upper and lower) kindly share if any guidelines or formula for the same
.gif)
