Electronics Forum: lisas pdf notes (Page 1 of 4)

Interleaving paper for Immersion Silver PCBs

Electronics Forum | Thu Jan 17 20:09:43 EST 2008 | davef

"silver saver" paper It can be purchased as an industrial product: * corrosionvci.com/corrosion_control_vci_paper.htm * daubertcromwell.com/pdf/silverg.pdf * corrosionprotection.net/corrosion/proddetail.php?prod=silversaver48R * jamesdawson.com/Silv

Rework Procedures

Electronics Forum | Tue May 27 12:53:15 EDT 2003 | davef

Our solder irons are tuned to 700*F, but the in-use temperature varies according to the solder alloy and the characteristics of the board and components. Check some of the papers on multilayer ceramic capacitors. They get fairly specific, for insta


Electronics Forum | Wed Aug 28 19:30:45 EDT 2002 | davef

This all gets confusing with this jargon and that. There is a fair amount of tutorial material on the web. For instance: http://brl.ee.washington.edu/CE/notes/lec_pcb.pdf

PCB ESD protection

Electronics Forum | Thu Mar 20 07:19:38 EST 2003 | davef

Here's one approach: http://www.littelfuse.com/PDFs/AppNotes/ec616.pdf We have no relationship or receive no benefit from the company referenced in the above link.

LGA design

Electronics Forum | Tue Feb 17 11:36:33 EST 2004 | POC

Try Amkor web page here http://www.amkor.com/products/notes_papers/appnotes_LGA_0902.pdf Regards POC

Wrinkles on soldered BGA ball joints

Electronics Forum | Fri Oct 07 09:19:54 EDT 2005 | Kris

the direction in which the solders cool in a BGA are also different than the rest of the boards as the joints " hidden" to ambient. Refer to an analogus phenomenon in the cookson application note. http://www.cooksonsemi.com/pdfs/How%20&%20Why%20Bum

I want to learn about bga technology from a pick and place mache

Electronics Forum | Fri Mar 18 14:15:35 EDT 2011 | floydf

I found it over here: http://cache.freescale.com/files/archives/doc/app_note/AN1231.pdf?fsrch=1&sr=2

Can you wave solder this part

Electronics Forum | Thu Aug 24 06:58:19 EDT 2006 | davef

Darby National published stencil recommendations for their LGA in the "SMT Assembly Recommendations" section of: http://www.national.com/an/AN/AN-1187.pdf Is it possible that Silicon Laboratories published a similar document for your Cygnal CP2101?

High Aspect Ratio Via Fills

Electronics Forum | Fri Apr 05 12:09:51 EST 2002 | davef

Conductive Silver Epoxy Holefill Process Dupont CB100 (Note: Dupont Recommendations) * Board Thickness: 0.008" to 0.085" * Drilled Via Size: 0.008" to 0.018" * Aspect Ratio: 1:1 to 6:1 On learning more, try: * http://www.ipc.org/html/S17-4a.pdf * Du

Silicone Grease where is it used?

Electronics Forum | Fri Sep 12 08:22:31 EDT 2008 | davef

Your supplier is probably the best source of advice on this issue. Some offer tips like: http://www.n0ss.net/hakko_808_notes.pdf Depending on the design, some use grease to reduce air leakage on: * Filter tubes * Gaskets or O-rings * Threads We ha

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