Electronics Forum | Thu Jan 17 20:09:43 EST 2008 | davef
"silver saver" paper It can be purchased as an industrial product: * corrosionvci.com/corrosion_control_vci_paper.htm * daubertcromwell.com/pdf/silverg.pdf * corrosionprotection.net/corrosion/proddetail.php?prod=silversaver48R * jamesdawson.com/Silv
Electronics Forum | Tue May 27 12:53:15 EDT 2003 | davef
Our solder irons are tuned to 700*F, but the in-use temperature varies according to the solder alloy and the characteristics of the board and components. Check some of the papers on multilayer ceramic capacitors. They get fairly specific, for insta
Electronics Forum | Wed Aug 28 19:30:45 EDT 2002 | davef
This all gets confusing with this jargon and that. There is a fair amount of tutorial material on the web. For instance: http://brl.ee.washington.edu/CE/notes/lec_pcb.pdf
Electronics Forum | Thu Mar 20 07:19:38 EST 2003 | davef
Here's one approach: http://www.littelfuse.com/PDFs/AppNotes/ec616.pdf We have no relationship or receive no benefit from the company referenced in the above link.
Electronics Forum | Tue Feb 17 11:36:33 EST 2004 | POC
Try Amkor web page here http://www.amkor.com/products/notes_papers/appnotes_LGA_0902.pdf Regards POC
Electronics Forum | Fri Oct 07 09:19:54 EDT 2005 | Kris
the direction in which the solders cool in a BGA are also different than the rest of the boards as the joints " hidden" to ambient. Refer to an analogus phenomenon in the cookson application note. http://www.cooksonsemi.com/pdfs/How%20&%20Why%20Bum
Electronics Forum | Fri Mar 18 14:15:35 EDT 2011 | floydf
I found it over here: http://cache.freescale.com/files/archives/doc/app_note/AN1231.pdf?fsrch=1&sr=2
Electronics Forum | Thu Aug 24 06:58:19 EDT 2006 | davef
Darby National published stencil recommendations for their LGA in the "SMT Assembly Recommendations" section of: http://www.national.com/an/AN/AN-1187.pdf Is it possible that Silicon Laboratories published a similar document for your Cygnal CP2101?
Electronics Forum | Fri Apr 05 12:09:51 EST 2002 | davef
Conductive Silver Epoxy Holefill Process Dupont CB100 (Note: Dupont Recommendations) * Board Thickness: 0.008" to 0.085" * Drilled Via Size: 0.008" to 0.018" * Aspect Ratio: 1:1 to 6:1 On learning more, try: * http://www.ipc.org/html/S17-4a.pdf * Du
Electronics Forum | Fri Sep 12 08:22:31 EDT 2008 | davef
Your supplier is probably the best source of advice on this issue. Some offer tips like: http://www.n0ss.net/hakko_808_notes.pdf Depending on the design, some use grease to reduce air leakage on: * Filter tubes * Gaskets or O-rings * Threads We ha
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