Electronics Forum | Wed Mar 08 10:52:27 EST 2000 | Wolfgang Busko
Hi Jacqueline, for the "manufacturing allowance" IPC says FAB.TOL. is the board manufacturing tolerance and PLACE ACRCY is the pick and place accuracy. For 0,8 mm pitch they give for both values 0,1 mm. Solder joint design goal data comes from empir
Electronics Forum | Wed Jan 19 08:40:53 EST 2000 | Wolfgang Busko
Hi Erico, I think it�s just a naming problem. Under the topic of tombstone there are a lot of causes for different appearances of this symptom. Shouldn�t be always the errected position that occurs. In your case it seems that either the components so
Electronics Forum | Wed Dec 22 05:42:19 EST 1999 | Wolfgang Busko
Hi John, I�ve seen problems some sites have or had with bridging problems in the wavesolder process with 1206 and 0805. Adjusting the system and focussing on the flux parameters sometimes improved things. With some older systems it was hard to get s
Electronics Forum | Mon Dec 20 12:50:27 EST 1999 | Wolfgang Busko
Hi Pascal, 0,65mm pitch normally isn�t much of a problem. With 90�m CU I don�t have any experience but would like to know what deviation from nominal value for the pads you get with different PCB-deliveries. In short, for the standard Cu=35�m we se
Electronics Forum | Mon Dec 20 07:59:04 EST 1999 | Wolfgang Busko
Hi Mike, many questions and there is no simple answer. How did you manufacture your add-on-boards ? Do you think you can handle the processes that go along with assembling SMT- and THT-Boards ? Before you start determine what you gonna do: - How man
Electronics Forum | Thu Oct 07 04:46:03 EDT 1999 | Wolfgang Busko
| Our first article inspection after machine placement can take several hours depending on the complexity of the board. The operator visually checks the board against the drawing and bill of material. I'd be interested to hear if there are any other
Electronics Forum | Thu Feb 10 04:07:29 EST 2000 | Wolfgang Busko
Jeff: We had a similar problem a couple of years ago with boards from one specific subcon. At first sight the joints looked well formed sometimes with a little bit more sometimes with a little bit less solder but still in limits not to be worried abo
Electronics Forum | Wed Oct 25 10:11:09 EDT 2000 | Wolfgang Busko
Paddesign, aperture size and stencil thickness determine the amount of solder for your joint. Once you have found suitable parameters you need to control the volume of your paste deposit which is influenced by printer settings, paste condition, stenc
Electronics Forum | Tue Aug 22 10:22:59 EDT 2000 | Wolfgang Busko
Mark: The fact that these daughter boards have to be attached to the TSOP-footprints is what makes the thing difficult cause they will be greater than the original part. One could think that a LCC-design allows for proper routing. But when it comes t
Electronics Forum | Wed Jan 26 12:48:56 EST 2000 | Wolfgang Busko
What does easy to use mean? From operators view: - simple input menue - precise error messages with suggestions what to check first - trustable feeders - low noise - feederchange possible without stop - automatic pickup-position alignment - safety fe
