Electronics Forum | Thu Aug 17 09:38:28 EDT 2006 | pjc
Having the last two zones at the reflow temp (spike) is typically done on long ovens (10 zone) running at high conveyor speeds. This enables you to achieve peak temp and TAL as per the solderpaste specs at high production rates. Concerning reverse sp
Electronics Forum | Thu Sep 21 20:37:21 EDT 2006 | basem
Does anyone on this forum has experience with any of i-PULSE SMD placement systems? I am looking at the M4e. Also, can someone advise me on what to choose if the desired final circuit is of very high density and small pitch (0.5mm)? I am considerin
Electronics Forum | Fri Dec 08 02:40:45 EST 2006 | Mike Konrad
Hi 'K', We manufacture both batch and inline defluxing equipment so we have no axe to grind with either technology. There are pros and cons associated with both technologies under specific conditions. Batch machines are typically good cleaners but
Electronics Forum | Tue Dec 19 20:54:52 EST 2006 | Guest
Your experience is quite different than mine. At continues dispensing,I noticed that glue dispense volume increase as the material in the syringe decrease. My machine is using air time pressure pump. This is normal for this kind of pump since ai
Electronics Forum | Tue Dec 26 22:18:20 EST 2006 | davef
Common methods to replate components are: * Barrel plating http://www.finishing.com/Library/zemo/barrel.html * Hot solder dipping - MIL-F-14072 M258 Certainly you can do this yourself by dipping the component leads into a solder pot containing lead
Electronics Forum | Tue Mar 27 16:22:10 EDT 2007 | donjohnson
60G are common, as are vibration events of >1.5Grms. And drop heights are just outrageous, old billy throwing your new server off the truck doesn't care too much about the glass house theory, but loves to throw anything that he can lift... say he cra
Electronics Forum | Tue Sep 11 19:04:28 EDT 2007 | hakerem
Hi Shrek - Not sure why you think adjusting dwell time and preheats is a sales pitch, but I do appreciate your candor. These are proven, widely used techniques for attacking, eliminating and preventing the recurrence of blowholes. Since it is so ea
Electronics Forum | Sat Sep 08 08:55:24 EDT 2007 | davef
We expect to see a copper shadow along the edge of pads when soldering boards with organic solderability protection [OSP]. IPC-A-610 has defined this as acceptable for years. During early reflow stages, the flux in paste dissolves the OSP where ther
Electronics Forum | Fri Dec 21 10:54:17 EST 2007 | isd_jwendell
All or nothing You do not need to purchase everything all at once. You can start with the manual stencil printer and oven, which are the lower cost items and easiest to maintain. Placing parts by hand will be very time consuming, but you can do a fe
Electronics Forum | Fri Feb 01 17:24:40 EST 2008 | kpm135
I work for a small electronic contract manufacture and we are currently evaluating pick and place equipement hoping to improve the quality of our build and increase our cappacity to boot. We are a high mix/low volume shop and I'd say our average buil
