Electronics Forum: making (Page 261 of 833)

CSM 84V: damaged parts (mmelf, 0805) during placing.

Electronics Forum | Tue Dec 20 07:58:32 EST 2005 | dwensker

Thank you all for your info. Our problem is fixed. We did as you mention: - chuck set correctly on the collers, Wide jaw Soft spring & Narrow jaw hard spring - make the pick-place soft - slow down the speed controllers for both descent and ascent r

How to disable feeder slots

Electronics Forum | Tue Dec 20 16:47:22 EST 2005 | toml

Parameters -> Cameras) Look at the camera serial tag and you should see C4 or OAL or C4 OAL. Make sure the camera type is set to strobed RS170 (C4) or whatever type you have. Then set defaults for this camera, and power cycle. This will fix the f

what is the cause of green decay on the soldered wires

Electronics Forum | Wed Dec 07 12:28:37 EST 2005 | PWH

I have seen problems similar to this caused by too high concentration of cleaning solution used in ultra-sonic cleaning process. If cleaning solution is used, make sure it is compatible with solder process. Also, improper mixing of fluxes and solde

BGA Reballing

Electronics Forum | Wed Dec 07 18:37:24 EST 2005 | russ

You need a thicker mask/stencil, the openings should be .005" larger than ball diameter and the thickness should also be .005" thicker than the ball diameter. by making the mask thicker you can then just roll or scrape the extra balls off and any d

Gold Pads Soldering problem

Electronics Forum | Wed Dec 14 06:32:20 EST 2005 | tk380514

Not all but some new boards we have had solder joint problems, for example some of the pads refuse to solder at all and the solder paste ends up attched only to the leg, reworking makes no difference and a variety of fluxes have failed. How can some

Solder Paste Problem (M705)

Electronics Forum | Thu Dec 15 21:23:57 EST 2005 | davef

Welcome. A day and a half seems like a very long time to leave paste on your stencil. We'd expect that the volitiles in the flux would have left the building in that time, making the flux less active. We start with fresh paste at the beginning of

X7R woes

Electronics Forum | Mon Dec 26 13:31:16 EST 2005 | mariss

Addendum: The boards are 2" by 2.4" (50mm by 60mm) and have 158 SMT components and 20 thru-hole parts. The nine X7R caps are distributed over the board; some are in the middle, others are near the V-grooved board edges. There is no discernable rel

X7R woes

Electronics Forum | Wed Jan 04 05:11:58 EST 2006 | dougs

I've seen cracked caps due to de-panelling on caps 40mm in from a board edge, if the cap lies on a stress line it can be cracked quite far in, i'd go with the other replies and make sure you use a "pizza cutter" type de-panelling machine for v-scored

SN100C vs. SAC 305 wave soldering

Electronics Forum | Mon May 22 07:01:16 EDT 2006 | Rob

Hi Grant, I've seen a couple of good fluxes on lead free - WF-7742 from Indium & JS-EU-01 from Koki. I'm sure everyone else has a good one too - just make sure it is one formulated for the elevated temperatures involved. Cheers, Rob

AOI vs. electrical test

Electronics Forum | Wed Jan 04 09:05:53 EST 2006 | stepheniii

Your process makes a bigger difference. What I have seen is ICT done early is better than AOI done more than a half shift later, and AOI done early is better than ICT done more than a half shift later. For high mix/low volume, I would go with AOI whi


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