Electronics Forum | Mon Nov 06 10:29:28 EST 2000 | Dean Stadem
All of the replies have merit. Here is another one. Because the cause of the tombstoning is wetting forces that are imbalanced, and one end wets faster or more readily than the other, the 0402 lifts up on that end easily because of its low mass. Incr
Electronics Forum | Mon Oct 30 16:00:30 EST 2000 | Finepitch Services
Sal, I kind of assume you have paste there to start with... Because sometimes the edge components do not have paste applied caused by the bottom support in the screen printer etc. And if that is the case for one direction, the other direction applie
Electronics Forum | Tue Oct 31 14:52:25 EST 2000 | Dr. Kantesh Doss
Hi Antonio: You clearly have printed excessive amount of solder paste on the pad. You can reduce the amount of paste by one or two methods: 1. Switchover to 5 mil thick stencils. 2. Change the design of your stencil openings (at the discrete compone
Electronics Forum | Mon Oct 09 17:49:29 EDT 2000 | sean
Hello John, The biggest stumbling block is going to be taking these responses and applying them to your assembly process much the same as trying to make other manufacturers' defect levels apply to your process. Ultimately, the overall quality of yo
Electronics Forum | Tue Oct 03 20:35:23 EDT 2000 | Dave F
1. Throughput * Dispenser: Slower, may loose 70% of tact on fast chip shooters * Printer: Can be put in front of and use fast chip shooters effectively 2. Rework Rate ???? Deposition control???? * Dispenser - High control over amount paste - Coplan
Electronics Forum | Tue Sep 26 09:27:10 EDT 2000 | Chris May
LarryK, It all depends upon your volume / problem. As Jax says, if this is a repeating problemo, get QA & Purchasing involved. Is it your stores ? Do they receive 100 off and "decant" 20 into a tube (manual handling error, training etc;). From your
Electronics Forum | Wed Sep 20 19:34:13 EDT 2000 | Dave F
Congrats. You now control the source of almost 70% of the defects of your SMT operation. There is a neat series of presentations on printing, each year at SMI. One of the best of the SMI series was in 1997, because presenters used a common board
Electronics Forum | Tue Jan 23 22:38:43 EST 2001 | rpereira
I have recently completed a HUGE screen-printing DOE. I used Taguchi methodology and man I got good results! Here is what I learned for what it's worth: (p.s. to the MPM apps guy I sent a copy to Tim Gillis, Lou Fuda, etc...) EFab vs. Laser: EFab
Electronics Forum | Thu Aug 24 12:35:30 EDT 2000 | Wolfgang Busko
The dilemma with this is that the search in the archive is often not that enlighting as someone might hope. Fact is that each new question (and the answers as well) on old topics adds to the archive making it not better. Well, and than look for the r
Electronics Forum | Tue Aug 22 10:22:59 EDT 2000 | Wolfgang Busko
Mark: The fact that these daughter boards have to be attached to the TSOP-footprints is what makes the thing difficult cause they will be greater than the original part. One could think that a LCC-design allows for proper routing. But when it comes t
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