Electronics Forum | Sat Dec 03 03:56:47 EST 2005 | hamidrezamaddah
Primary methods used to test circuit boards > are: * Automated test equipment [ATE] * Manual > bench-top functional test equipment > > Printed > circuit board ATE market segments are: * > In-circuit ATE * Functional ATE * Boundary > Scan ATE
Electronics Forum | Tue Jul 25 12:14:39 EDT 2006 | russ
All my studies led me to believe that it was CTE mismatch of this package. Altera was of less than 0 help in this matter. The other possibility was an ICT test fixture. Unfortunately (?) the design life of this product was at end and the new design
Electronics Forum | Tue Dec 06 14:30:49 EST 2005 | Samir Nagaheenanajar
I agree with Ken!! Amen to that, brother! At my company here in Rihad, our design guys are in a tizzy about lead free components and tin whiskers, and with every questionable through-hole solder joint, or when our purchasing department gets "notif
Electronics Forum | Wed Dec 14 07:27:34 EST 2005 | chunks
"find yourself a good stencil manufacturer its there job really just tell them what machine you have and they should do the rest." I have to dissagree with this last statement on so many levels. There's a reason why it's called engineering. Plus,
Electronics Forum | Wed Dec 14 07:53:57 EST 2005 | tk380514
Aperatures are often best decided by the stencil manufacturer principally because they would know what is easiest and best for there laser cutting machines, why would i dictate to them something that would not work well for there machines. but are yo
Electronics Forum | Wed Dec 14 08:06:07 EST 2005 | tk380514
Also we have just made a prototype for Wave soldered SMT components D-packs + 0603 + TSSOP�s on the bottom side with THT comp. on the top, the stencil manufacturer gave his personal library of glue stencil openings and adviced on stencil thickness wh
Electronics Forum | Tue Dec 13 12:46:15 EST 2005 | Slaine
We came across a manufacturer selling us a part that they Classed as RoHS compliant. On further investigations the part was found to contain lead, we use an XRF. The content was over 85% so was exempt and therfor compliant(HMP solder), until we solde
Electronics Forum | Wed Dec 14 22:43:46 EST 2005 | 00629
Im from a semiconductor manufacturing company and we received feedback from customers about cover tape tearing on 16mm heat activated cover tapes...the manifestation of the tear is that it starts from both sides of the seal and continues towards the
Electronics Forum | Thu Dec 15 04:26:20 EST 2005 | Rob
Hi Liza, We tend to see it on the larger plastic tape sizes & lower volume parts - such as smd connectors, fine pitch reeled IC's, BGA's etc. We don't tend to get it on high vol parts such as logic, 8 & 16bit micros, v-regs etc. Could this be du
Electronics Forum | Fri Dec 16 04:41:30 EST 2005 | tk380514
A day and half is a life time for our solder paste, Almit V14L... but then we dont have in-line solder paste printers, we have micro BGA stencil that wont work with anything but new solder paste, 0.8mm pitch and pad size is 0.3mm, stencil thickness
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