Electronics Forum | Mon Aug 18 20:46:08 EDT 2008 | davef
Volume of paste = 2X volume of the hole Questions are: * Why does your customer want the hole filled with solder? * Would materials other than solder be acceptable? * We assume 0.020" is drill size. What is the finished size of the hole? * What is t
Electronics Forum | Mon Sep 08 02:39:37 EDT 2008 | akareti
By connector, you mean socket? Connector use for board to board connection from FCI, MFG P/N: 84500-202 What is the material of the connector(socket)? Is it very frigale? Housing: liquid crystal polymer Solder ball: SnPb 63/37 how big are the bal
Electronics Forum | Tue Sep 16 17:56:36 EDT 2008 | slthomas
"....over 3500 apertures in a circuit that is about 1 x 1.5 inches..." 8O Yeah, Larry would definitely be the go-to on this one. :P I would think reducing stencil thickness would be your best bet to avoid that ratio problem, but how durable is a .
Electronics Forum | Fri Sep 26 07:26:33 EDT 2008 | realchunks
Looks like lack of wetting. What is the BGA ball material? Could be high temp. Could be improper profile. Could be paste sat on board too long / flux dryout. Could be co-plane mount and this ball touched at the end of reflow curve. Could be cont
Electronics Forum | Mon Dec 22 14:15:41 EST 2008 | ck_the_flip
As Emil says, it's 100% the glue! Your paste is not designed to hold parts on at wave solder. Reflow is MUCH hotter than glue, so I doubt you're not adequately heat-curing it. Possibly, the glue cure is "too hot" and maybe making the material brit
Electronics Forum | Wed Jan 07 10:37:08 EST 2009 | evtimov
Hi, in the beggining of PB free process, there were a lot of solder pastes based on a Bismuth and some other materials, mainly because of their low melting temperature. The feedback shows problems in the mechanical strenght of the joints with the ti
Electronics Forum | Tue Jan 20 12:23:13 EST 2009 | rgduval
Start off by suggesting that they buy the parts as they're going through their layout. Their engineers can output a BOM based on the design, and they ought to be able to buy to that. That also keeps you off the hook for material liability in case a
Electronics Forum | Wed Feb 04 16:33:40 EST 2009 | davef
Your specification for all PCB suppliers of 'solder mask over bare copper using LPI on external layers (green)' is broad and open to the use of material from many possible LPI suppliers by your board fabricator. In at least one case, it appears that
Electronics Forum | Tue Feb 10 00:57:50 EST 2009 | emmanueldavid
Philip, Pl note that there is one more fabricator from Malasia, whom we found to be up to the mark with Wave Soldering Pallets constructed with Durastone/CDM Durastone. They also offer ESD Protected to match ESD guidelines of Assembly & Photo Sensi
Electronics Forum | Tue Feb 10 01:18:28 EST 2009 | emmanueldavid
Philip, Pl note that there is one more fabricator from Malasia, whom we found to be up to the mark with Wave Soldering Pallets constructed with Durastone/CDM Durastone. They also offer ESD Protected to match ESD guidelines of Assembly & Photo Sensi
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