Electronics Forum | Thu Jun 25 09:08:14 EDT 1998 | Russ Miculich
Thought I'd jump in as I helped develop materials for the FC game. Au/Pb - bumping - talk to Hughes Tuscon about this. They do it and will discuss the process. For Flip Chip Technology here in the States - contact Peter Elenius at Flip Chip Techno
Electronics Forum | Tue Apr 09 21:40:26 EDT 2002 | ianchan
We are a local enterprise with limited resources, just like you described, so hope this experience sharing helps : we place a production Visual Mechanical Inspection (VMI) inspector at the end of each Reflow Oven area, complete with magnify scope 30
Electronics Forum | Wed May 08 23:18:58 EDT 2002 | ianchan
Hi mates, have this SMT production issue : A) We have a leadless-chip-carrier(LCC) IC package that is classified under the Land-Grid-Array(LGA) package family. B) The LCC is 4mm x 4mm, and has 28 tin plated pads located beneath the outside perimet
Electronics Forum | Tue Sep 26 14:06:33 EDT 2006 | patrickbruneel
Jun 26, 2006 (See Comments Below) Editorial Managing the Naughty Child Mike Martel, Editor, Circuitnet I've been listening to voices on both sides of the RoHS issue and the more I hear, the more foreboding the tone becomes. Despite what some wr
Electronics Forum | Mon Oct 26 02:00:36 EDT 2020 | chucherry5076
https://www.jrpanel.com/R The heat generated by electronic equipment causes the internal temperature to rise rapidly. If the heat is not dissipated in time, the equipment will continue to heat up and the components will overheat and fail, resulting
Electronics Forum | Fri Dec 01 17:03:57 EST 2000 | Dave F
Curious, very curious ... Residues � Where are these residues? [solder & laminate / mask, solder only, laminate / mask only] What is the result of your analysis to the residues? How do you know it�s a flux residue, rather than a chemical by product
Electronics Forum | Mon Nov 27 17:47:23 EST 2000 | Dave F
Gyver: Lemme take a wack [if you�ll excuse the expression, given direction of the later discussion] at your questions. Q1. Will the baking of BGA or PCB cause more oxidation before the SMT process? A1. It certainly will not cause less oxidation,
Electronics Forum | Mon Sep 11 04:10:46 EDT 2000 | Jim Arnold
I spent 25 years operating my own hybrid shop working with surface mount components, soldering materials and procedures. Dealing all the while with it's associated surprises and problems such as yours. Now-a-days I get paid to investigate and attemp
Electronics Forum | Thu Jul 13 22:20:38 EDT 2000 | Dave F
=10 mils larger than lead 3 silk screen legend text weight >=10 mils 4 pads >=15 mils larger than finished hole sizes 5 place through hole components on 50 mil grid 6 no silk screen legend text over vias (if vias not solder masked) or holes 7 so
Electronics Forum | Mon Jun 26 20:34:14 EDT 2000 | Dave F
Gary: Allow expand on this topic a bit. Back in the gray skied past when people wore calculators on their belts, rather than pagers n Palms, and didn�t drink California spill, they used HASS that you mentioned and HALT (Highly Accelerated Life Test
