Electronics Forum | Wed Jan 12 13:27:42 EST 2005 | carobin
The two options I see are (not including underfill): 1) Have complete conformal coating coverage of all balls with no webbing in between balls because of CTE mismatches. If all the balls are not coated we see failure in humidity testing. or 2) Sea
Electronics Forum | Wed Apr 13 15:32:37 EDT 2005 | mmjm_1099
Don't know if this helps at all but here you go. I take care of documentation, smt programming, and bill of materials and notes. We have a smaller company so this is how we handle alot of the issues at hand. Our product traveler consists of what w
Electronics Forum | Tue Jul 12 08:34:35 EDT 2005 | stepheniii
If they don't come within 12 inches of ESD sensitive material, would it matter? Although to be honest it would still make me nervous. Anytime you see static cling, you have the potential for ESD. (pardon the pun) Also if you see dust or other fine m
Electronics Forum | Tue Nov 01 18:00:07 EST 2005 | PWH
The front nozzle plate arm had a build-up of grease and material on the roller plate that is closest to the linear bearing. This material caused the nozzle plate to be lower than normal; therefore it was not able to push the nozzle all the way to th
Electronics Forum | Fri Jan 06 08:43:20 EST 2006 | pjc
Yes, that's why wiper system metal material has been changed to stainless steel. There is an approved solvent list on the Speedline Tech web site. Go to: http://www.speedlinetech.com/news_publications/application-notes.aspx?OnId=5 Then go down to
Electronics Forum | Thu Mar 09 16:14:19 EST 2006 | marc
CGO Assuming your system is performing well here are a few ideas to help out your profile.... - Pull the material spec and ensure you are meeting the requirements for times and temp. Many times the material will allow a mild soak of the board prior
Electronics Forum | Tue May 30 10:55:57 EDT 2006 | bryanhewson
I am a lay person researching the application of non-woven material in stencil rolls either using branded material or non-branded alternatives for DEK, MPM Panasonic machines in SMT environments. I have read a number of articles referring to aqueous
Electronics Forum | Thu Aug 17 10:30:08 EDT 2006 | Chunks
Hi McGill, The straight ramp is "straight" from the manufacturers of the material. Using old process techniques from your old process materials no longer applies. We all miss the good old days, but it�s time to move on. Being of Asian descent, I t
Electronics Forum | Mon Oct 02 21:36:03 EDT 2006 | davef
All of us wave solder FR4 all day-long, not to say we have never had problems doing it. The selection of the laminate material should depend on the burnin application. We'd be concerned about a FR4 burnin board that saw GT 150*C for extended period
Electronics Forum | Tue Oct 17 20:15:12 EDT 2006 | davef
In the past, black poly was used as a bridge between pink poly and shield bags because of slightly lower cost and offering some shielding as opposed to none with pink poly. However, as the price of shield bags continue to drop the usage of black poly
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