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Used SMT Equipment | Assembly Accessories
Panasonic's BM231 modular high speed multi-functional placement machine boasts any volume, any mix capability by placing a wide array of components from 0402 (01005) microchips to BGA's, CSP's and connectors. Outstanding productivity is a
Used SMT Equipment | Pick and Place/Feeders
Detailed Product Description 1. The acquisition for the rectangular coordinate of X-Y direction. 2. Check for the existence, transformation, user in the feeder 3. The installation is to euip it with actual device and consolidation in feeder base
Used SMT Equipment | Pick and Place/Feeders
A JUKI high-speed patch machine JX-350 prototype and JUKI long substrate high-speed patch machine JX-350 are available for sale. They are most suitable for LED lighting machines or LED patch machines for medium and large LCD backlight production.&nbs
Used SMT Equipment | Screen Printers
Windows 10 Software Machine Alignment Capability: ±12.5 µm @ 2.0 Cmk, (±6 Sigma) System Alignment Capability: +/- 20μm @ 2.0 Cmk, (±6 Sigma) Wet Print Capability: ±25 µm @ 2.0 Cpk, (±6 Sigma) - Cer
Used SMT Equipment | AOI / Automated Optical Inspection
Product description: Optical System Imaging Method Dynamic Imaging Top Camera 4 Mpix Angle Camera N/A Imaging Resolution 10 µm, 15 µm (factory setting) Lighting Multi-phase RGB+W LED 3D Technology Single/Dual 3D laser sensors (opti
Used SMT Equipment | AOI / Automated Optical Inspection
Product description: Optical System Imaging Method Dynamic Imaging with true 3D profile measurement Top Camera 4 Mpix Angle Camera N/A Imaging Resolution 10 µm, 15 µm (factory setting) Lighting Multi-phase RGB+W LED 3D Technology S
Used SMT Equipment | AOI / Automated Optical Inspection
Product description: Optical System Imaging Method Dynamic Imaging Top Camera 4 Mpix Angle Camera N/A Imaging Resolution 10 µm, 15 µm (factory setting) Lighting Multi-phase RGB+W LED 3D Technology Single/Dual 3D laser sensors (opti
Used SMT Equipment | AOI / Automated Optical Inspection
Product description: Optical System Imaging Method Dynamic Imaging Top Camera 4 Mpix Angle Camera N/A Imaging Resolution 10 µm, 15 µm (factory setting) Lighting Multi-phase RGB+W LED 3D Technology Single/Dual 3D laser sensors (opti
Used SMT Equipment | AOI / Automated Optical Inspection
Product description: Optical System Imaging Method Dynamic Imaging with true 3D profile measurement Top Camera 4 Mpix Angle Camera N/A Imaging Resolution 10 µm, 15 µm (factory setting) Lighting Multi-phase RGB+W LED 3D Technology S
Used SMT Equipment | Pick and Place/Feeders
SM321S 1608CHIP: 21K CPH(IPC) 1005CHIP: 20K CPH(IPC) SOP16: 15K CPH(IPC)/feeder QFP100: 5.5K CPH(IPC)/pallet The placement accuracy of Samsung SM321: CHIP: ±50µm (0402@3σ) QFP: ±30µm (QFP168@3σ) The PCB b
