Electronics Forum | Wed May 22 17:16:11 EDT 2002 | russ
We currently have two samsung CP20 CVs unfortunately I have no experience with the MyDatas The Samsungs are pretty good machines, They seem to be pretty solid all around but have experienced placement problems with 216 pin 16mil pitch QFP. The soft
Electronics Forum | Thu Jun 13 21:44:21 EDT 2002 | jkhiew
Hi all, * Defect : termial to terminal touching btw two melfs body that created short circuit. * Clearance : 0.8mm btw two melfs body. * Size melf : diameter=2.4mm to 2.7mm, length=4.8mm to 5.2mm * Stencil opening : "v" shaped to minimise component
Electronics Forum | Mon Jun 24 18:45:06 EDT 2002 | jersbo
I have done experiments on small runs, with a few connectors and have had favorable results, I had apertures (oversized)made for the thru-hole connectors on our SMT stencil and hand inserted the connectors.. A few insufficient solders here and there
Electronics Forum | Mon Aug 12 13:11:47 EDT 2002 | pjc
I am not a DEK user but have some knowledge of the ELA to share. The ELA has some structural differences with the Horizon and Infinity models. It is DEK's low-end automatic printer (a cost-reduced version of the Horizon model)and is manufactured in C
Electronics Forum | Mon Aug 12 18:26:05 EDT 2002 | pjc
If you are talking actual placement rate- from first fiducial read of board no. 1 to first fiducial read of board no. 2, here is the best I've ever seen based on the boards I've run: CP3- 141 seconds for 468 components per board (all rectangular chi
Electronics Forum | Fri Sep 06 14:35:47 EDT 2002 | bobm
I have been in smt for about 4 yrs. I would say you need to evaluate what type of components you are going to place. How many boards your orders will be for. I use Quad pick and place equipment. These are all around good machines for placing everythi
Electronics Forum | Tue Sep 17 15:47:42 EDT 2002 | stepheno
Where I worked previously we had some boards with a couple 15 mil pitch parts. The first batch we got all had undersized pads. We had lots of bridging. We had less bridging with bigger pads. The ball size in the paste makes a bigger diffence regar
Electronics Forum | Mon Sep 23 03:12:01 EDT 2002 | surachai
We encounter this problem also , I know that it 's acceptable per IPC standard but sometime it fail at ICT and FCT , then this problem should be prevent , we found it with QFP 16 mil pitch and the defect looklike negative wetting at the front of lead
Electronics Forum | Tue Sep 24 12:49:43 EDT 2002 | dragonslayr
Aperture reduction @ 5 mils thickness is your best bet. It may take several attempts to get just the right paste volume. What aperture reduction was specified to the stencil house for these specific LEDS? or was the stencil blindly produced using a
Electronics Forum | Fri Oct 18 17:47:37 EDT 2002 | russ
What is the determination of poor soldering fails pull test, non-wetting, visual)? I have never heard of an SMT component that has leads higher than the body of the component. Refer to IPC 782 3.6.1.7 it provide the guidelines for SMT standoff heig
