Electronics Forum: mil (Page 96 of 200)

QFNs (LCCs)

Electronics Forum | Fri Dec 22 07:11:32 EST 2006 | billyd

Wait a second... 10 to 15 mils at toe end. How are you doing that? See, the ones we did have a bit of a time with had no catellations on the outside. So, it's like a BGA in that regard. All your paste goes under the part, so if it's not even, or if i

Universal GSM Placement Data...

Electronics Forum | Wed Jan 03 18:56:41 EST 2007 | SWAG

CSV from excel works great on GSM. P/N, x, y, theta is all you need. When you do CAD upload, GSM software allows you to name columns so you don't really have to have it in any order as long as you understand it. You can also convert mils, mm, inch

Solder paste handing

Electronics Forum | Tue Jan 16 15:42:45 EST 2007 | slthomas

Now yer talkin'! FTR, I've seen 7 month old (5 month shelf life in a 45� F fridge) WS based pastes in tubes turn to clay and refuse to print through anything less than about 50 mil pitch. This was stuff stored in the fridge per mfr's spec. I suspe

JUKI 2050/2060 comments? anyone?

Electronics Forum | Thu Jan 25 13:49:57 EST 2007 | John S.

James, We have 3 750's that are 5-8 yrs old. Never any major issues. Juki's service and support are the best. We bought a 2060 1 year ago and have been pleased with it. We placed a 20 mil pitch QFP with a spec of +/- 0.003" to test the machine.

QFN - FCT failed after reflow

Electronics Forum | Wed Feb 07 09:37:48 EST 2007 | billyd

Had the very same thing happen the first time we used the small QFNs. The aperture for the thermal pad in the center needs to be cut in a grid form, either squares (with around a 10 mil spacing between openings) or circles, like a BGA pattern. Too mu

Blindage soldering

Electronics Forum | Fri Feb 09 17:09:29 EST 2007 | flipit

I think it depends on the shield and how it is configured. If your shield has some openings and your placement process is good, you can try it and see how it goes. I place small shields on small PCBs (1" X 2") and have no problems. There are 20 mi

Stencil design

Electronics Forum | Fri Mar 02 00:21:38 EST 2007 | AMS

Hello, I havea 0.4mm pitch TQFP with heat transfer pad on the bottom side of component. I will appreciate any suggestions with regards to: 1) stencil thickness (Rest of components on board are 0603 passives and few 40 mil pitch IC's) 2) Stencil

Pick & place

Electronics Forum | Sat Mar 24 20:01:43 EDT 2007 | colormaker

I am sure there are many levels of machines from startup to high production. There are two machines we have been looking at from Mancorp MC383VIV. I have not done business with them but there sales team make an effort to call one a month asking if we

Solder paste dispensers question

Electronics Forum | Fri Apr 27 11:23:40 EDT 2007 | pjc

You can get reliable solderpaste dots down to 20-30mil dia. with Type 3. Accurate and repeatable dispensing machine for X-Y-Z placement of the dot is critical. Here are the leading machines: http://www.speedlinetech.com/camalot/index.aspx http://

Kester paste problems

Electronics Forum | Tue May 22 12:27:04 EDT 2007 | cyber_wolf

I would consider calling Kester and telling them they need to send their people out. I could not really see mesh size being an issue on anything 20mil and above. There are several other issues that can cause aperture clogging as well...: Incorrect


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