Electronics Forum: minimum (Page 46 of 77)

Question on Cyberoptics Sentry 2000 implementation

Electronics Forum | Mon Jul 12 10:14:32 EDT 2004 | tigerlordgm

I am working as part of a team to set up a new automated SMT line, with the idea being to keep it as hands off as possible. As part of this, one member of the team has purchased a used Cyberoptics Sentry 2000, which hasn't arrived yet. Since Cyberopt

soft gold vs immersion gold

Electronics Forum | Mon Aug 16 20:32:10 EDT 2004 | davef

First, we didn't say "electrolytic soft gold with a minimum thickness of 5-8 of Au". We said, "'electrolytic soft gold' thickness 5 to 8uin". FOCUS. ;-) Second, we're unaware of an industry accepted specification that you can reference. IPC-2221

Looking for small Dishwasher type cleaning

Electronics Forum | Wed Sep 01 14:58:59 EDT 2004 | Shean Dalton

To address the last sentence of the recent posting, Austin American Technology does have experience with board cleaners as described. More recently AAT developed a cleaning system simliar to your description called the AquaBatch. The AquaBatch was

BGA Solderability Standard

Electronics Forum | Tue Sep 14 17:10:54 EDT 2004 | Jeff, jjg6@agere.com

USE JEDEC Specification EIA/JESD22-B102-C Procedure: 1. Stencil print BGA solder paste pattern onto ceramic substrates 2. Carefully and accurately P&P BGA devices onto the dispensed solder paste pattern to avoid smearing the solder paste. 3. R

Keystone 1071 Battery Clip Solder Problem

Electronics Forum | Thu Jun 02 12:08:49 EDT 2005 | cuculi54986@yahoo.com

Does anyone else use the Keystone 1071 battery clip? http://www.keyelco.com/kec/standpro/specpage/spec140.htm I have been having a seemingly strange problem reflow soldering this battery clip. The negative lead always solders fine and looks beauti

smt scrap reduction

Electronics Forum | Wed Jun 15 16:54:33 EDT 2005 | linny999

Siemens is an excellent platform. To reduce your scrap:- Carry out the specified maintenance, especially the segments and valve plungers; Calibrate revolver heads to benchmark. Remove the tables, smooth the magnetic strips, clean the mounting faces,

component to scored edge clearance

Electronics Forum | Mon Jun 20 09:12:55 EDT 2005 | davef

There's no easy answer. It depends on: * Thickness and size of the PCB in the array. * Means of separation. * Type of component. SMT components are more sensitive to the forces that need to be applied to separate the PCB. * Type SMT device. Ceram

PCB SolderPad Yellowish

Electronics Forum | Mon Sep 05 01:38:12 EDT 2005 | plcc

I hv a PCB (mtrl is RF35). After going thru' reflow, we found yellowish stain on the solder pad (solder mask). It looks like burn-marks. The reflow temp use is 245oC. We tried running bare pcb under 220oC, there's minimum stain found (acceptable),how

Fudical, where, size, etc

Electronics Forum | Wed Nov 02 08:57:34 EST 2005 | russ

Don't have any graphics but they are relatively simple. 1. They do need to be put into the copper. 2. We usually use a 1mm circle but many other shapes and sizes are useable but I know that all machine will take a circle. 3. Maintain a keepout area

CP6 Maintenance

Electronics Forum | Thu Mar 30 12:57:21 EST 2006 | cyber_wolf

Fuji has said a lot of things in the past, then changed it later on. Just for the sake of argument....The guys that have trained me worked at Fuji for a minimum of 12 years. Not quite sure what Tech is talking about, but I do not recommend doing w


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