Electronics Forum: missing fillet (Page 1 of 3)

solder fillet peeling update....

Electronics Forum | Mon Jul 14 12:24:02 EDT 2003 | MA/NY DDave

Hi So Steve, I must have missed something from your last subject topic. "solder fillet peeling" Are you saying you or they, Ultrasonic Clean for 20 to 30 minutes after soldering and that is suspected as causing the cracking at the top of the compo

IC Solder Voiding

Electronics Forum | Fri Nov 22 16:59:43 EST 2019 | dwl

I'm worried about the voids that you have on the heel fillet of the leads. Off the top of my head, I don't recall if/what the IPC spec is for voids in gull lead fillets is but my gut instinct is that you're compromising the mechanical strength of the

Quality Inspection post Wave

Electronics Forum | Thu Aug 04 16:34:03 EDT 2005 | bhu

You haven't mentioned whether you are producting only through hole product or if it is mixed technology. What kind of flux (no clean, H2O clean) you are using and whether you performed a first article at part stuffing prior to wave. Generally, you

Solder cover

Electronics Forum | Mon Mar 08 05:03:24 EST 2010 | grahamcooper22

Hi, I fully agree with isd.jww. The difference in the solder joint appearance of the 2 joints highlighted could be down to a few reasons...reflow profile (I know you've checked, but have you stuck a thermocouple on this actual joint ? ), contaminatio

Epoxy on bottom of SMT component

Electronics Forum | Wed Nov 28 01:28:32 EST 2007 | shy

Q1:What is the relation between component standoff and drop missing? A1:component standoff will identify either solder paste at SMT side can form the fillet at component terminal or not. Drop/missing component is totally out of the topics since i jus

SMD Gull Wing Switch Cracking

Electronics Forum | Wed Dec 18 16:21:54 EST 2019 | jrow

Hello! We are having field failures due to cracking of the solder on our SMD micro switch components. I have been reading the IPC standards, and the only thing that it states regarding the solder profile/amount for Gull Wing component is "wetted fill

A.O.I - no salesman pitch pls

Electronics Forum | Tue Jun 10 20:31:55 EDT 2003 | iman

In a perfect world, the machines would be maint."guys" for the automation machines. Think "closed loop" system. Anyway, getting back to our reality job, we are still game for automation to improve thru'put, quality, reduce problems. The focus here

Re: Solder Fillet Problem on 0603 chip capacitor

Electronics Forum | Fri Oct 13 15:26:20 EDT 2000 | Dave F

We periodically see chip caps with poor solderability. Often terminations are missing plating.

AOI Omron VT-RNS-pt - Help with some basic programming questions

Electronics Forum | Fri Oct 11 03:56:39 EDT 2019 | chrislandafont

Hi Tsvetan, Yes, I've heard it's difficult to program but good once it gets going. At the moment, I'm working through the manuals, but can't find a step by step guide, just lots of reference material on how to do things, but not knowing what orde

How to improve the solder quality of QFN?

Electronics Forum | Mon Jun 27 09:38:30 EDT 2005 | Bob R.

What problems are the quality people seeing? I hope they aren't expecting a toe fillet. QFNs are typically cut from an array after plating. This leaves exposed copper on the sides of the part. We'll often see smearing from the sawing process that

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