Electronics Forum | Thu Feb 04 10:25:03 EST 2016 | tombstonesmt
Have you re-visited your paste manufacturers profile requirements? Start there, adjust accordingly to critical components on the boards (ie LED's, moisture sensitive, etc..).
Electronics Forum | Mon Aug 22 18:25:54 EDT 2016 | cox1
I have a MS level 3 component that has been on the shelf for 7 years. Should it be baked before usage. The HIC card reads ok- and it was stored with desiccant. History of the part is unknown, was purchased from franchised distribution.
Electronics Forum | Fri Sep 09 05:29:25 EDT 2016 | jasltd
simpel answer is yes it will need to be baked, the typical shelf life for a sealed component assuming it has been sealed would be a max of 2 years but some are shorter. The bugger problem with the device may well be solderability of the device!
Electronics Forum | Fri Feb 02 05:11:29 EST 2018 | deanm
I developed our company's procedure for moisture sensitive devices based on J-STD-033 and I don't recall anything requiring a certain ramp rate. Furthermore baking at 85C will greatly extend the time to reset the clock and it is harder to maintain
Electronics Forum | Wed May 15 16:18:58 EDT 2019 | stephendo
Look up the glass transition temperature (Tg) for the PCB material. If you get the PCB above this temperature it will become quite soft. If it is a populated board remember to take any moisture sensitive devices on it into consideration.
Electronics Forum | Fri Nov 01 08:39:43 EDT 2019 | johnce
At this point, I do not plan to back-fill with nitrogen. I have confirmed that vacuum baking, with the temperature set to 40°C, will result in the chamber %RH being less than 5%.
Electronics Forum | Mon Oct 02 12:43:30 EDT 2023 | daniel_stanphill
I agree with dontfeedphils. Any time we run into a moisture sensitive component that cannot go through our wash cycle, we solder the component(s) by hand after everything that can be washed has been reflowed and cleaned.
Electronics Forum | Tue Mar 24 09:48:15 EST 1998 | Steve Schrader
| Do you know if there is an IPC standard or industry standard | that addresses the proper process for handling MSD's in the production environment....? (rework etc.) | Not the receiving area. | Thanks so much, | Robin Arnold | PCB Development | Har
Electronics Forum | Mon Aug 14 20:37:03 EDT 2006 | davef
JEDEC defines packaging, matrix trays, tape and reel, and like whatnot. You need to be searching ANSI and IPC. Find these documents: * ANSI/J-STD-020, Moisture/Reflow Sensitivity Classification for Plastic Integrated Circuit Surface Mount Devices *
Electronics Forum | Mon Aug 13 18:16:31 EDT 2001 | fmonette
Be very careful how you perform the removal process if you want to re-use BGA/CSP devices. As you are aware, the majority of these components are classified as moisture-sensitive by the manufacturer. This means that if they absorb too much moisture
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