Electronics Forum | Fri May 15 10:27:16 EDT 1998 | Justin Medernach
| | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin package
Electronics Forum | Tue May 26 11:11:59 EDT 1998 | Steve Gregory
Hi Peter, There's been a lot of discussion on this topic lately (baking parts), and that got me reading the IPC-SM-786A, which is pretty good. For your first question, the parts absorb moisture over time. The type of package mold compound
Electronics Forum | Tue May 26 14:42:55 EDT 1998 | Justin Medernach
| We currently bake plastic SMT parts in accordance with the IPC guidelines for moisture sensitive parts. Because we have double-sided boards that are subjected to either an aqueous or semi-aqueous cleaning process, we do a 24 hour bake at 125 deg.
Electronics Forum | Fri May 15 10:06:28 EDT 1998 | Mike
| We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin packages. |
Electronics Forum | Tue May 18 10:14:04 EDT 2004 | Rob
What affect does moisture have on sensitive components on a board as it waits for thru-hole assembly? Suppose I run a batch of boards today and the assembly dept won't be able to get to it til maybe a month from now, is it okay to just let the boards
Electronics Forum | Wed Aug 20 11:15:40 EDT 2008 | 18424
Hi all, Wanted to get some input from you guys and gals, I have check the archives and found not much. I am putting together an MSD program here at the company i work for, and was wondering how other people are tracking their times in/out for compone
Electronics Forum | Mon Apr 29 22:41:36 EDT 2002 | davef
Refer to J-STD-33 - Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface-Mount Devices. You can be downloaded it free from http://www.jedec.org Assuming you want to meet expectations when selling your components to
Electronics Forum | Mon Jun 19 09:47:23 EDT 2017 | georgetruitt
You have a lot to think about! What does the flux manufacturer recommend as far as specifics like water temp or pressure? Do they recommend high temp di-water a detergent or saponifier? Do you currently have a cleaning machine, batch cleaner or inl
Electronics Forum | Thu May 20 19:11:48 EDT 1999 | Earl Moon
| | hello...can somebody help me regarding the POPCORN at Reflow. What is this POPCORN at reflow, what it looks like, its cause and corrective action if there is... | | | | your help is greatly appreciated...thanks | | | | omat marasigan | | | Deo
Electronics Forum | Mon May 18 11:39:30 EDT 1998 | Earl Moon
| | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin package
