Electronics Forum | Thu Aug 05 21:20:40 EDT 2004 | davef
The entrapped moisture WILL escape. You just want to assure it is not through your PTH and via. Hopefully your board is constructed such that the alternate escape path for the moisture does not delaminate the board.
Electronics Forum | Mon Apr 18 20:44:30 EDT 2005 | davef
Charly: Why do you "need to bake the PCb due to moisture issue", if you're not going to use the board? Why bake the board, just to put it back in storage, absorb moisture, and require baking again?
Electronics Forum | Tue Aug 15 19:07:13 EDT 2006 | vlad_uk
With the added temperature peak associated to Lead free reflow is anyone seeing or concerned about the increased vapor pressure that may result from moisture entrapment in moisture sensitive components?
Electronics Forum | Wed Jan 17 05:05:30 EST 2007 | Phil J
The most likely cause is moisture vapor outgassing violently from the Tant package. They are known to be moisture sensitive. Try baking some at 120C overnight and reflowing those.
Electronics Forum | Fri Jul 20 08:26:52 EDT 2007 | cyber_wolf
SMT adhesive is hydroscopic. Some types absorb moisture faster than others. Moisture+SMT adhesive= pourous adhesive after cure. Excessive cure ramp rates can also contribute to porosity.
Electronics Forum | Thu Aug 28 13:15:59 EDT 2008 | omid_juve
how can i be sure that the device isn`t affected by moisture ? i mean that if the pins are oxidized due to the moisture how can i remove this oxidization ?
Electronics Forum | Tue Sep 02 12:43:12 EDT 2008 | stepheniii
That could lead to oxidation of the leads and worsen solderability. It's much better to make sure the components are handled properly and not exposed to moisture. The reason for baking is moisture in the body not in the leads. Why is no one suggest
Electronics Forum | Wed Sep 03 12:29:47 EDT 2008 | omid_juve
That could lead to oxidation of the leads and > worsen solderability. It's much better to make > sure the components are handled properly and not > exposed to moisture. > > The reason for baking is > moisture in the body not in the leads. > > W
Electronics Forum | Thu Dec 04 09:49:11 EST 2008 | lazzara55
Dear Steven: Often the recommendations for baking prior to assembly are derived from various J-stds. But J's currently concern baking moisture out of components, and fail to address the moisture issues of the PCB. Because of that, there is the IPC D
Electronics Forum | Sat Jul 25 08:47:25 EDT 2009 | davef
Both "moisture content of bare board" and the "thickness of the copper plating in the PTH" are related to each other. As you heat the solder connection, moisture in the board boils and out-gasses through the solder connection. Plating with the proper
