Electronics Forum | Tue May 15 12:21:14 EDT 2001 | medernach
Another possibility could be the moisture monster. SMT adhesives are extremely hydroscopic. Was it one syringe in particular or your entire lot going haywire? Are you in a humid area? EG if you're manufacturing in AZ you may not need to worry abo
Electronics Forum | Wed Jan 26 17:02:22 EST 2000 | Morris
One thing I've found that will create that white residue is when moisture comes in contact with that flux. 1. Verify that you are not introducing any moisture with the compressed air supply at the foam fluxer. 2. Replace the flux and clean the flu
Electronics Forum | Fri Nov 19 03:40:30 EST 1999 | JohnW
Folk's, I'm looking for information on moisture sensitive devices for our trainer's to use when explaining the concept to new recruit's. There seem's to be load's and load's of info available to ESD but very little for MSD, so I thought I'd ask the
Electronics Forum | Fri Oct 29 04:51:11 EDT 1999 | Wolfgang Busko
Hi Eom, no matter what size the crack is it�s a no-no and you should take any precaution to avoid this cracking. Ask your vendor if you are not sure which moisture level applies for your part. Follow the recommended handling specifications for moistu
Electronics Forum | Mon May 18 11:39:30 EDT 1998 | Earl Moon
| | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin package
Electronics Forum | Tue Mar 24 09:48:15 EST 1998 | Steve Schrader
| Do you know if there is an IPC standard or industry standard | that addresses the proper process for handling MSD's in the production environment....? (rework etc.) | Not the receiving area. | Thanks so much, | Robin Arnold | PCB Development | Har
Electronics Forum | Tue Sep 04 11:09:25 EDT 2001 | blnorman
As the others have stated, moisture is the killer. You have to be sure no moisture is allowed to get to the paste. If it does, you'll get solderballs. I would suggest not using a vacuum. The solvents and other volatile components of the flux will
Electronics Forum | Wed Oct 17 18:42:37 EDT 2001 | scott
Any processes that I need to be aware of that differs from standard FR4 during reflow and wave soldering? I've read one of the problems is the thermal expansion of teflon is quite different from copper. I've also seen a "blurb" where teflon absor
Electronics Forum | Thu Jan 03 08:01:23 EST 2002 | davef
In addition to a previous poster's comments, you many want to understand moisture sensitive components better. Start with: * J-STD-020 and J-STD-033. Download them here: http://www.jedec.org/download/default.cfm * �Moisture Sensitive Components� R
Electronics Forum | Wed Feb 06 19:28:43 EST 2002 | sleech
I agree with Francois. We have just announced a 55 deg. C LTVP drying process that can greatly speed moisture removal. It is also effective for drying components that remain in tape and reel, conductive plastic shipping tubes or trays. Process time
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