Electronics Forum | Wed Feb 03 21:18:33 EST 2010 | mika
BTW. The "duster" since it's in a closed container under pressure; when released, there will be moisture around the area. Water that is. Not so good on MSD-components... Sincerely
Electronics Forum | Wed Apr 28 14:52:03 EDT 2010 | davef
When we hear the words 'flexible circuit' and 'delamination' in the same sentence, we think: * Excessive reflow temperature. * Entrapped moisture. Boardhouse: I hope this is a step towards redemption.
Electronics Forum | Mon May 24 19:24:35 EDT 2010 | jry74
We bake all of our boards at 220 degrees F for two hours. This bakes out all the moisture. Blow off the parts prior to placing in the oven.
Electronics Forum | Sat Jun 19 00:49:17 EDT 2010 | mun4o
Hi all, lately ofen I have problem with cracked ceramic capacitors.We use 0805 and 0603 cap. Samsung.ICT measure diferent capacity of nominal.If I tray to desoldering component , then component cracked.I think , that the reason is the moisture in com
Electronics Forum | Fri Jun 25 13:52:51 EDT 2010 | tate350
Are there any tantalum caps near the BGA? I have seen "wet" tant caps releasing moisture during reflow and disrupting the BGA balls. It may result in missing balls or bridging.
Electronics Forum | Sat Aug 07 02:28:20 EDT 2010 | raghu
We have PVA 350 benchtop dispensing equipement with humiseal 1A33 CC material. is there any moisture measurement process in conformal coating material?
Electronics Forum | Fri Oct 01 09:32:25 EDT 2010 | mazjal7
Rob, thank you for input. I notice you mention a baking process for the flex circuits, this is our first time with flex assembly, do the flex circuits need to be baked prior SMT, Moisture? Thanks, David
Electronics Forum | Fri Oct 15 08:01:12 EDT 2010 | patrickbruneel
What you have is blowholes. Baking your boards prior to soldering will help. Root cause is either barrel plating too thin or barrel cracks allowing laminate moisture to escape. Patrick
Electronics Forum | Fri Oct 15 08:00:09 EDT 2010 | patrickbruneel
What you have is blowholes. Baking your boards prior to soldering will help. Root cause is either barrel plating too thin or barrel cracks allowing laminate moisture to escape. Patrick
Electronics Forum | Wed Dec 08 20:58:17 EST 2010 | Jacki
Hi Dave Now, I knew the Humidity for Solder paste. How about for the Epoxy? Very appreciates your soon reply. Thanks
