Electronics Forum: moisture (Page 71 of 135)

Baking Moisture Sensitive Components >4.5mm

Electronics Forum | Wed Jan 17 11:30:23 EST 2007 | Colleen Miller

We have some larger MSL3 parts that require baking. they are 6mm thick which takes them off the chart provided at http://www.jedec.org/download/search/jstd033a.pdf Does anyone have a reference that would tell me the baking times for these component

Baking Moisture Sensitive Components >4.5mm

Electronics Forum | Mon Jan 22 14:22:46 EST 2007 | muse95

Actually, I've been looking into this myself, and the B version doesn't help any more than the A version. The tables still only go to 4.5mm. And Appendix B has a bunch of formulas with undefined variables that I haven't been able to figure out. An

Baking Moisture Sensitive Components >4.5mm

Electronics Forum | Mon Jan 22 16:41:21 EST 2007 | davef

Contact: * JC-14.1 Subcommittee on Reliability; Chair: Jack McCullen, Intel; jack.t.mccullen@intel.com 480-554-5354 * Rich Shook, Brian Vaccaro, and Brian Pottieger - Agere Systems [ http://www.agere.com ] * Francois Monette; Cogiscan Inc.; 450-534-2

wave frames CAS - cleaning

Electronics Forum | Wed May 16 12:32:34 EDT 2007 | realchunks

Most Durastone product have a very low moisture absorbtion rate. This makes it ideal to water wash them. I wouldn't tlet them soak in the water, but you shoul dbe safe to wash them usinf water. Once the water is used up, you should treat it as a h

Vacuum Bags

Electronics Forum | Wed May 16 13:02:12 EDT 2007 | slthomas

Moisture barrier bags are polymer coated foil so are nearly gas impermeable. There's always some coating left at the weld (or it wouldn't stick) so they're not completely sealed but that's as good as it gets. Usually people use the vacuum to remove

Delamination on IS410 laminate

Electronics Forum | Wed Aug 01 18:14:13 EDT 2007 | swag

We had the same trouble. We baked our boards out but the delamination continued very random. One board would be fine and the next was a nasty explosion of delam. Switched material - no problems since. I never found out the technical reason behind

PWAs & PWB bake out requirements

Electronics Forum | Thu Aug 09 19:13:37 EDT 2007 | htran

DaveF, Our customer requirement is to comply with IPC-STD-001 but the J std doesn't specify the bake out temperature for populated boards and the moisture absortion rate. Right now we are baking the populated PWAs after aqueous wash at 80C at 18-48

Moisture Sensitive part - baking

Electronics Forum | Fri Aug 24 12:20:41 EDT 2007 | petep

I have an MSL3 part (a relay) supplied in tape and reel. From what I am able to determine, these parts require baking at 257 degrees F for a minimum of 8 hours once the integrity of the seal is broken for over 168 hours. How are parts baked at th

Moisture Sensitive part - baking

Electronics Forum | Fri Aug 24 17:30:40 EDT 2007 | jmelson

Oh, for a second there I thought it was 257 C, not F. Solder temperature! Still, one WEEK at 257 F seems way extreme. Maybe this is to bake out a part that has been underwater for a week. Is this a military part? I can't imagine any commercial-g

Moisture Sensitive part - baking

Electronics Forum | Sat Aug 25 08:24:15 EDT 2007 | davef

We're unfamiliar with such component dryout requirements. Commonly, tape & reel cover tape will seperate at 60*C. So, even if your baking on a metal reel, your should keep the bake temperature ~40*C. Sure makes you want to use these parts during th


moisture searches for Companies, Equipment, Machines, Suppliers & Information

Equipment Auction - Eagle Comtronics: Low-Use Electronic Assembly & Machining Facility 2019 Europlacer iineo + Placement Machine  Test & Inspection: Agilent | Tektronix | Mantis Machine Shop: Haas VF3 | Haas SL-20 | Mult. Lathes

World's Best Reflow Oven Customizable for Unique Applications
Electronics Equipment Consignment

High Resolution Fast Speed Industrial Cameras.
Selective soldering solutions with Jade soldering machine

High Throughput Reflow Oven