Electronics Forum: mount (Page 111 of 225)

Quad Machines? Good Points / Bad Points

Electronics Forum | Thu May 02 10:27:18 EDT 2002 | BTaylor

I have used Quad/ Now Tyco since the early 90s starting with the 4c then on to the QSA-30s, APS-1, and now the Meridian 1010. We have six machines in a very small area and place over 10 million components per month. As others have said the service is

Design Guide

Electronics Forum | Mon Apr 29 02:50:03 EDT 2002 | Bob Willis

The basic guidline is lead size plus 0.010" which you can also use for through hole reflow/intrusive reflow. Most suppliers of the insertion equipment quote this as the minimum clearance hence its a good guide. Druing recent trials for through hole

CMMs (Coordinate Measuring Machines)

Electronics Forum | Tue May 07 02:58:27 EDT 2002 | dwoon

Hi, We are looking for some measuring machines to evaluate the ability of a SMT placement machine to produce quality. We will mount some dummy components on a glass plate and then insert the assembly into the measuring system which can measure the

CMMs (Coordinate Measuring Machines)

Electronics Forum | Tue May 07 09:36:38 EDT 2002 | jax

Daniel, If you just plan on mounting chip components don't worry about getting an accurate measurement. The parts will vary in size, corrupting your accuracy measurements. If you are going to place leaded components you can probably get awa

double side reflow soldering

Electronics Forum | Mon May 13 10:37:56 EDT 2002 | fmonette

The other important issue relates to moisture sensitive devices (MSD). If you have MSDs on the first side, you need to track the remaining floor life of the components on the partially assembled boards between the first and second reflow. Contrary to

Connector Removal

Electronics Forum | Wed May 29 12:41:46 EDT 2002 | peterson

I'm out here on the leftcoast. Actually, our method for removal is: break down the sides, pull each pin individually. It's tedious and time consuming, but it can be accomplished with little risk of damaging the board. Customers are curious, however.

SMT DESIGN

Electronics Forum | Tue Jun 11 17:12:29 EDT 2002 | mdmilward

Hello, Can I please get some help on finding formulas for calculation of surface mount pad sizes for stencil design and solder paste deposition. I've recently joined a company who has allowed their stencil supplier to develop the stencils based upon

via in Pad

Electronics Forum | Tue Sep 17 15:03:31 EDT 2002 | davef

Contact: * PCD Magazine [ http://www.pcdmag.com/mag/reprints.html ] and ask them to send you a reprint. * Jim Blankenhorn [ http://www.smtplus.com ] and ask him to send you a reprint. Or try: * �Assembly And Interconnect Reliability Of BGA Assembled

Selective soldering pallets and solder balls

Electronics Forum | Tue Dec 17 08:38:30 EST 2002 | Randy Villeneuve

Jim, In most cases if you can eliminate a process you will save money. With that in mind, an all surface mount or all through hole design is prefered. There are alternatives to that rule, like hybrid designs that can be pin and paste soldered. It al

Connector leads plating

Electronics Forum | Tue Dec 10 05:03:58 EST 2002 | praveen

We are having solder fillet finish issue. The solder looks like rough solder on the connector leads .The plating of the leads is Nickel (99.9% purity) and the PCB plating is imersion gold. I have tried fine tuning my reflow profiles an have used N2 i


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