Electronics Forum | Tue Apr 09 05:10:39 EDT 2002 | sanchai
Dear sir, Do you have experiment about the temperature cycling and vibration test for reliability testing of surface mount solder attachment. If yes, please give me the soft file sample of parameter setting and testing report.. Thank you very mu
Electronics Forum | Tue Apr 09 18:29:34 EDT 2002 | davef
Any-Layer Interstitial Via Hole (ALIVH). In printed circuit board fabrication, a registered mark of Matsushita Electric for a filled microvia structure in all layers for applications requiring small-size, lightweight build-up PWB to achieve high-den
Electronics Forum | Mon Apr 29 00:15:30 EDT 2002 | GregH
If IPC-SM-782 is for Surface Mount Land Pattern, what is the Standard used for Through Hole Guide (eg. Component Lead Thickness versus Hole diameter etc.), where can I find them? thanks
Electronics Forum | Mon May 20 23:01:16 EDT 2002 | dwoon
Hi guys, What are the major inefficiencies that most EMS companies faced in a high-mix/low-volume manufacturing? And, what in general an equipment manufacturer (especially surface-mounting equipment manufacturer) can help them to improve the product
Electronics Forum | Wed May 29 14:24:51 EDT 2002 | caldon
Stick with round aperatures they work fine. If you are successfully processing fine pitch QFP's then switching to BGA's should be no problem. Profiling is a little tricky, a thermal couple should be mounted at the under/ center of the component. cal
Electronics Forum | Wed Jun 19 04:54:45 EDT 2002 | ianchan
Nuez : u mean u put an operator to check the placement mounting of components, juz before the PCBA enters the reflow oven? how does that release the bottlenecks for efficiency rates? pls explain, coz we want to learn from your experiences. Thanks.
Electronics Forum | Thu Aug 01 04:12:39 EDT 2002 | jk
Anyone have experience with BGA mount on via hole in pad. I'm encountering about 1 to 2% yield loss due to BGA solder short. This is an entek PCB. The BGA pad size is 32 mil, and the via hole (dia. 10 mil) is at the center of the pad. Any professiona
Electronics Forum | Thu Jan 09 07:39:27 EST 2003 | Susan
I need a manufacturing/process engineer with surface mount assembly exp in advanced fiber optic networking systems for video, audio and data transmission. If this is you please contact me right away. The position is on the east coast. Susan
Electronics Forum | Wed Aug 21 01:40:42 EDT 2002 | jkhiew
Hi all, Our management set target 50 ppm for overall process like printing,mounting & reflow soldering. Our m/c cpk for mounter is 1.0 & for printing is 1.33. So, pls comment !
Electronics Forum | Thu Aug 29 09:55:37 EDT 2002 | davef
Sounds like hyper-corrosion of nickel, commonly referred to as 'black pad', in ENIG solderability protected boards. Search the fine SMTnet Archives to get started. Additionally, the July - September 2002 'Journal Of Surface Mount Technolgy' has an
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