Electronics Forum: much (Page 481 of 629)

Re: Barcoding Component Reels

Electronics Forum | Wed Nov 01 12:10:20 EST 2000 | Jeff

charles, i can appreciate the hand held "reel to reel" scanner as a good solution that is very cost effective. during my smt supervision days we had a number of part loading checks. 1. load plan check, 2. scan check, 3. reel to reel manual check.

Re: Dark Pad / Gold Embrittlement?

Electronics Forum | Thu Jul 27 21:57:16 EDT 2000 | Dave F

Hi Doug: Responding to your questions: � If gold over nickel is self limiting ... You didn�t say whether you gold plating was electroless or immersion. Electroless is not is self limiting. It can plate up to 5 thou. Expect immersion plated gold to

Re: Bump Dies Solder Integrity

Electronics Forum | Tue Jul 18 20:10:09 EDT 2000 | Dave F

Hey Bud: Thanks for the response the other day. We currently use "Jeff�s Method #2: The Drummel Tool." Short answer to your brother is ... yes, probably. Expanding a bit: � It would be surprising not to use a flux to help reflow the solder balls

Re: solder joint problem?

Electronics Forum | Wed Jun 14 08:08:56 EDT 2000 | Wolfgang Busko

Hi ji tae, we had a similar problem with QFPs 0,5 pitch processed by one subcontractor. The symptoms we noticed were: - the solderjointshape and wetting looked normal - the surface had a dull gray appearance - by pushing a lead sideways with a tweez

Archives, FAQ's, newcomers

Electronics Forum | Fri May 12 11:14:43 EDT 2000 | Michael Parker

I have been following the "net for about six months. In the beginning I asked basic questions and was refered to the archives on occasion. Usually I had already tried, but maybe did not get the correct spelling of terminology which frustrated my sear

Re: Where's Earl Moon ?

Electronics Forum | Thu May 11 04:23:50 EDT 2000 | Earl Moon

Hey folks, I'm on your side, as I said many times in this string. To end it, from my point of view, I will offer the following diatribe with which I responded to one of you whom I respect very much - Dave F. This is my last say on the subject and I

Re: qfp and soic joint Problem

Electronics Forum | Tue Apr 11 20:26:16 EDT 2000 | Dave F

Jeremy: Parts assembler make leads of either Alloy 42 (Invar, whatever) or copper. The solderability of these leads are protected with eutectic or non-eutectic tin/lead solder, palladium or some palladium alloy, or gold. Cuppla things to consider:

Re: BGA REFLOW PROBLEMS

Electronics Forum | Mon Mar 27 20:48:25 EST 2000 | Dave F

Robert: Howya doin' bud? You say "BGA Shorting!!!" I say "Too Much Solder!!!" So, earlier comments about aperture design are appropriate, make good points, and I think we both agree that improvements could be made in your stencil design, but I'm

Re: Reliability of Reworked Pads/Traces?

Electronics Forum | Wed Mar 29 09:31:28 EST 2000 | Erick

Marc: My experience found reliability IS a function of operator skill and attension to the process. Expecially for some RF assemblies. I worked with an engineer from Rogers to develope a process for reworking Pads for a special material. (I thing

ICT Fixtures No-Clean Flux

Electronics Forum | Thu Mar 16 14:04:14 EST 2000 | Cartman

Greetings. My company has a VOC-Free no-clean wave solder flux with 4% solids. I have a number of questions as they relate to our ICT Fixtures. Currently, we're encountering the following issues: 1.) PM on probes....What is the recommended PM p


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