Electronics Forum | Mon Mar 20 19:27:14 EST 2000 | Marc Ruggiero
Hello, I am looking for inputs (experiential or opinions) concerning field reliability of high-frequency RF boards that have had a trace or pad repair (or both), any package type. If anyone can comment on this subject, I would appreciate it. We bu
Electronics Forum | Mon Mar 20 18:15:05 EST 2000 | Russ
Larry, SOTs are a wonderful thing to try and wave solder! They are about as nice as Tant caps. I have found that shadowing is usually the biggest problem assuming that the other wave parameters are good, in your case it seems that they are. Couple
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Fri Feb 25 14:34:44 EST 2000 | Ioan
Larry, the best paste thinner is the one that your paste supplier recommends. You should check with him. We have no problems removing the no-clean paste with alcohol. If you want to give it a try, make sure you use IP alcohol, not alcohol based flux
Electronics Forum | Fri Mar 03 10:20:12 EST 2000 | se
Steve, I'd stop worrying about the in-line feature of the printer, I've never really seen an in-line system that wasn't capable of batch operation and there will be very little, if any, cost saving associated with going batch load only. An in-line m
Electronics Forum | Thu Feb 17 11:38:53 EST 2000 | Steve Thomas
We appear to have solved a major reflow process problem (poor quality joints on a 20 mil QFP100...excessive solder left on the lead leg, not much left for a joint) with a design change to the board. We gave ourselves considerably more room for a hee
Electronics Forum | Wed Feb 16 15:29:15 EST 2000 | John S.
My company manufactures electronic modules for the automotive industry. We have a current product that the customer would like a "heavy duty" version of. The module will have to handle roughly twice as much power as the original. A couple of compo
Electronics Forum | Tue Jan 16 18:00:50 EST 2001 | mikestringer
Hi everyone I am in the process of reviewing our storage of SMT components. At the moment they are pretty much on open shelves in the factory environment. We endevour to reseal components labled 'moisture sensitive' in their original packaging, bu
Electronics Forum | Tue Jan 23 20:53:51 EST 2001 | davef
Sorry, not much help for me there. More information would be helpful. For instance: * Talk about the distribution of the problem, including a single lot or from various lots and over components and component types on the board * Tell us about the boa
Electronics Forum | Thu Feb 01 12:46:19 EST 2001 | cebukid
conveyor speed x dwell time = contact length and =====> inches / seconds x seconds = inches. First run your pump at a constant speed.....THEN,.... try running your glass plate at a very fast speed, and then you'll notice that your lengt
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