Electronics Forum | Mon Jul 22 15:35:28 EDT 2002 | davef
There has been books of stuff written on the topic. One expample is: http://nepp.nasa.gov/index_nasa.cfm/476/CD467677-8023-44E3-A795CBCF2DECFF05/
Electronics Forum | Sat Dec 10 07:28:12 EST 2005 | davef
Tin whiskers are real and can cause serious problems. That's why NASA maintains a web page on the issue. [ http://nepp.nasa.gov/whisker/ ] and why space flight is is exempt from Euroland lead-free requirements.
Electronics Forum | Thu Feb 01 08:47:07 EST 2007 | davef
NASA is concerned about outgassing in high-vacuum environments. They select materials to minimize outgassing. http://outgassing.nasa.gov/og_desc.html
Electronics Forum | Sat Feb 10 09:29:08 EST 2007 | davef
NASA requirements may be a good starting point http://www.hq.nasa.gov/office/codeq/solder.htm
Electronics Forum | Thu Jun 11 22:57:45 EDT 2009 | davef
NASA recommends baking a PCB for a minimum of 4 hours at 93+/- 5.5�C before conformally coating. [NASA-STD-8739.1, �Workmanship Standard for Staking and Conformal Coating of Printed Wiring Boards and Electronic Assemblies,� August 6, 1999]
Electronics Forum | Sun Jul 31 10:06:51 EDT 2011 | davef
Try the NASA Workmanship Standards Inspectors Pictorial Reference document: http://workmanship.nasa.gov/lib/insp/2%20books/frameset.html Look at Section 7.08 SURFACE MOUNT TECHNOLOGY (SMT) BUTT "I" LEADED PACKAGES
Electronics Forum | Fri Jun 03 16:00:44 EDT 2016 | davef
"aerospace" + "harsh environment" = NASA NASA BGA Guidelines - chrome-extension://gbkeegbaiigmenfmjfclcdgdpimamgkj/views/app.html
Electronics Forum | Tue Feb 03 21:36:29 EST 2009 | davef
NASA gets itself in a froth about the potental for whisker growth in high tin solders used in space applications.
Electronics Forum | Fri Jun 05 15:13:51 EDT 2009 | patrickbruneel
Look in attachment what NASA has to say about lead free electronics
Electronics Forum | Tue Sep 22 11:33:08 EDT 2009 | jdumont
Good ol NASA... thanks Dave
