Industry Directory | Manufacturer
A Manufacturer of High Quality, Precision, Automated Fluid Dispensing and Conformal Coating Systems, SMT Cover Tape Peel Tester and Lead Forming machines for through-hole component preparation.
Industry Directory | Consultant / Service Provider / Manufacturer
Electronic manufacturing services - electronic design, development and manufacturing. Circuit board design, prototyping, FPGA services, signal integrity and simulation, pcb assembly. Factories in California USA and Malaysia.
New Equipment | Curing Equipment
The mini vertical oven has a cycle time of 25 - 60 seconds per 150mm fixture, 4mm Edge Hold Pins and Guides. PCBs up to 250mm wide can be processed. Dual Feed option for high throughoutput. In-line, vertical automation of the epoxy cure process prod
Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form
Electronics Forum | Wed Sep 01 14:36:14 EDT 1999 | S. Schoppe
I am looking for a service company to verify my AC/DC converters meet the vendors specs.
Electronics Forum | Wed Jan 31 01:11:37 EST 2007 | dave
that bloody newton bloke is there anyway less"wastefull 'out of these 3 options
Used SMT Equipment | Wire Strippers
We have an immediate need for Autosplice SAS splice machines. If you have one, or multiple; please contact me asap. Thanks ashlin@bajabid.com 813-992-2437
Used SMT Equipment | Soldering - Wave
We have a customer with an immediate need for an Electrovert VectraElite Wave Solder machine. Please contact us ASAP if you are able to fulfill this requirement.
Industry News | 2018-07-02 07:23:51.0
Heller Industries Announces That It Will NOT Be Subject To The 25% Import Duty on Reflow Oven Purchases
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Parts & Supplies | Pick and Place/Feeders
For those of you in need of #Mydata Agilis Feeders and/or magazines, make sure you check out this online auction ASAP. https://lnkd.in/e4ZkS5hW
Parts & Supplies | Pick and Place/Feeders
Yamaha Manual Tray Feeder If have any parts need to repair or need more info about parts, pls don't hesitate to contact the following details: Website : www.ksunsmt.com Email: jenny@ksunsmt.com Skype:jenny@ksunsmt.com MP: 0086-15629932323 Wha
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2023-09-07 14:54:10.0
A global manufacturer of a broad line of electronic interconnect solutions worked with us to dispense conductive adhesive EpoTek H20E-FC. EpoTek H20E-FC is a two-component, electrically conductive, snap curing epoxy for photovoltaic thin film module stringing, semiconductor packaging and PCB circuit assembly. The primary goal was filling a rectangular cavity on a connector. The epoxy needed to fill the connector to the top of the walls in less than three seconds.
Nano-copper sintering in formic acid vapor.
Increase productivity, improve quality, reduce costs with vertical format curing solutions from Heller Industries. Learn more: http://www.hellerindustries.com/755-Vertical-Oven.php
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | IPC/WHMA-A-620 Specialist (CIS)
The Certified IPC/WHMA-A-620 Specialist (CIS) training focuses on cable and wire harness fabrication and installation.
Events Calendar | Tue Dec 03 00:00:00 EST 2019 - Tue Dec 03 00:00:00 EST 2019 | Anaheim, California USA
IPC Tech Ed - Process and Acceptability Requirements: Utilizing J-STD-001 and IPC-A-610 Together
Events Calendar | Thu Feb 20 00:00:00 EST 2020 - Thu Feb 20 00:00:00 EST 2020 | Manchester, New Hampshire USA
IPC Tech Ed - Process and Acceptability Requirements: Utilizing J-STD-001 and IPC-A-610 Together
Career Center | Florham Park, New Jersey USA | Engineering
Field Service Engineer Job Description The basic function of this position: Installation, training, repair, and implementation of retrofits on the complete line of Heller reflow ovens. Candidate must be a US citizen. DUTIES AND RESPONSIBILITIES: S
Career Center | Dallas, Texas USA | Engineering
Skills/Requirements: BS Degree needed, 5+years of management experience out of test engineering. Electronic manufacturing a must. In-Circuit and functional test experience needed. Strong customer interaction needed. Duties/Functions: Direct the t
Career Center | , India | Production
Reads instructions, such as work orders, drawing, and wire lists to determine materials needed and sequence of assembly, Manual Hand tool using for Wire cutting, stripping, crimping. Soldering, Splicing, Assembling PCB Boards, Boot Shrinking, Heat
Career Center | palakkad, India | Technical Support
I had 4 years experience 3 years in SMT Field and 1 year in Stock Market I have well experience in SMT process and machine Knowledge personally I have well knowledge on reflow, SPI,DEK AOI I can handle the process related issues and tackle the situa
