Electronics Forum | Mon Jan 13 06:28:15 EST 2003 | johnw
Hi folk's, I'm looking for some help full suggestions here... I've got a ceramic BGA with tn/lead / bismuth balls on it that is over collapsing due to the weight of the momponnet vs the ablity of theball to suppot them. We've spok eto the component
Electronics Forum | Mon Jan 27 10:33:16 EST 2003 | MA/NY DDave
Hi Just keeping this alive to see if anyone else posts. It seems to me that this might be a degradation due to life cycles of all products/services as they progress from creating high profits to being driven down and down in price. Topped off with
Electronics Forum | Fri Feb 21 20:01:14 EST 2003 | MA/NY DDave
Hi This is a good one. Let me take a stab at it. First remind me, why is this air coming in carrying a charge. I think I remember yet it is always fun. Also hopefully it isn't carrying any compressor oils. There are some companys that make other t
Electronics Forum | Fri Feb 28 08:57:34 EST 2003 | davef
We used to bake [100*C for 6 hours] all of our boards, but no longer bake at all. Before going off, your bake recipe is probaly OK. If anything, it's probably too short. Consider measuring the weight of wet boards, baking for a time, measure, bake
Electronics Forum | Wed Mar 05 02:50:31 EST 2003 | MA/NY DDave
Hi Excellent David F. I don't know about the company CAL is working for but I will tell you that sometimes companies hire a weak talent and convince them that they have a high sales potential. They offer a big commission yet a low salary in the 30K
Electronics Forum | Sat Mar 08 02:43:16 EST 2003 | Frank
We are trying to implement AOI into the mix. One PE wants it Pre-Reflow, to catch and fix the PnP screw ups and the other PE wants it Post-Reflow, because the oven will fix quite a bit of placement offsets and mainly to catch any problems that the R
Electronics Forum | Fri Mar 21 20:24:13 EST 2003 | msimkin
Has anyone had success in soldering these devices, in particular devices from a company callede Pycomp. They are 8 way 0402 sized terminations. I have experemented with the printing process, placement verification & reflow profile. Unfortuanlty, I am
Electronics Forum | Tue Apr 01 08:59:06 EST 2003 | rdr
Hi all, I've got a question that hopefully someone can provide insight. We have a gold immersion assembly that we believe is experiencing fractures or non wetting on a certain BGA. To be sure that it is a fracture and not a wetting issue I would li
Electronics Forum | Mon Apr 14 09:39:49 EDT 2003 | davef
Consider: * Sn has a higher melting point than Pb. So the liquidous temperature of this new, non-Sn63 is going to be higher than 183*C. What was the thermal recipe measured on this solder connection? * Next thing we'd do is take problem devices and
Electronics Forum | Sat Apr 19 10:45:43 EDT 2003 | Joe
Yngwie, In a previous life, I used a mixer made by Malcolm and was very happy with it. We used Alpha 609 WS paste and experienced no separation problems. The Malcolm equipment agitated the material in a non-concentric motion which tends to "fold
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