Electronics Forum | Fri Aug 30 16:25:21 EDT 2002 | davef
Imm silver holds-up to multiple thermal cycles very well. The things, we guess, are happening to make imm silver tough to solder after heating and sitting are: * Oxidation of the silver. * Reduction of the co-deposited organic anti-tarnish [used in
Electronics Forum | Wed Feb 26 23:59:48 EST 2003 | Mike Konrad
Grant, No-Clean paste + IPA = White Residue! #1: Stop using IPA #2: Switch to either a solvent-based de-fluxing chemical or an aqueous-based de-fluxing chemical. If you are using an ultrasonic cleaner for your boards as stated, do not use sapon
Electronics Forum | Tue Jun 10 01:09:37 EDT 2003 | iman
Hi! Thanks to you as the first replier! I do admit it "narrows" the information channels feedback flow by keeping this thread reply limited to "non-commercial" engineering folks, but I already have lotsa war stories from the salesmen around this reg
Electronics Forum | Thu Nov 13 17:18:11 EST 2003 | davef
First, don�t get distracted by �OA� and �NC� formulations. This is nomenclature. We want to discuss the issue of �activity�. J-STD-004 "Requirements for Soldering Fluxes" classifies fluxes by their chemical composition, activity level and halide c
Electronics Forum | Thu Apr 15 20:41:22 EDT 2004 | Ken
There are ledgitimate reasons for checking furnace calibrations, but let me clarify what that is. 1. TC's are not necessarily calibrted. Not unless you need "absolute" accuracy. TC's operate against a (non-linear) standard +/- a tolerance. Most
Electronics Forum | Wed Jun 23 10:05:17 EDT 2004 | exmaintenanceleader
Hi Grant, I'm ex Fuji service engineer I install also at Sagem Czecz Republik (Kladnow near Prague) in 2000 they use at new lines MPM- 2XCP643E and 1xUniversal GSM (French owen (I do not remember the exacly tipe) at second hand line they use 2x and
Electronics Forum | Tue Sep 21 09:49:50 EDT 2004 | Pomponio Magnus
Has anyone ever seen the distributions that result when plotting percent voiding? (Typically a BGA will have enough balls that you can get oogles of data.) I have seen this and seem to be noticing a pattern. First, they are not all normal, so your
Electronics Forum | Wed Feb 22 08:31:42 EST 2006 | davef
Q1 Are there any standard regulating the subject? Very few infos found on IPC. A1 We�re unaware of standards for packing and storage for most types of boards. * IPC 4553 standard for Immersion Silver Finish, 3.8 Packing and Storage. * J-STD-033 and E
Electronics Forum | Wed Sep 13 20:04:37 EDT 2006 | mika
Hi, We have a customer that want us to produce a single sided 0.4 x 100 x 50 mm size RoHS pcba approx 1000 of them. The board only contains three 2.54mm pitch Non P.I.P, SMT-connectors. We have never produced such a thin pcb:s before. We are thinkin
Electronics Forum | Fri Dec 22 16:04:26 EST 2006 | mika
Hi, This Not so easy as one wuold think. Has the thermal pad of yours vias? How many? What's the via's dia? What is the pcb thickness? If the the pcb has a "ground layer" connected (vias) to the pcb thermal pad, it could sometimes be a little bit tri
