Electronics Forum: not centered printing (Page 16 of 19)

Re: Solder Mask repair

Electronics Forum | Mon Apr 17 19:44:20 EDT 2000 | Dave F

Ashok: Well, your customer probably has a good reason for wanting you to send them boards without holes in the solder mask. What is their goal for the mask capabilities after you get do reworking the boards? * Cosmetic surface coat? * Performance t

Re: Repair of SMT boards

Electronics Forum | Sat Jun 05 07:23:20 EDT 1999 | Dave F

| Where I can find some informations about repairing of SMT boards? | | Thanks | | Marcos | Marcos: Ya know, repair is that "dirty little" part of the business that all try to ignore, don't want to fund properly, and creats more angst than propa

Re: Stencils Universal?

Electronics Forum | Tue Mar 16 14:37:42 EST 1999 | Steve Gregory

Hi Nancy! Just as Steve and Dean said, most printers have some sort of restrictions of what frame, where the image is positioned, ect. before the stencil will work in the printer. The two manufacturers that I'm most familiar with DEK and MPM do have

Re: PCB Warping.

Electronics Forum | Mon Mar 16 18:15:32 EST 1998 | ETS, LLC

Problem occurs because the glass transition temp for FR4 is lower than reflow temperature. Our company wrote an article which was printed in SMT magazine some years ago that deals with this exact subject. Best way to deal with this is to use a center

Re: Any success using metal squeegees w/Fuji GSPII?

Electronics Forum | Fri Jan 30 14:18:24 EST 1998 | M cox

| | Using metal squeegees on GSPs has caused premature stencil wear. Has | | anyone had any success with this combination? How much snap off did you | | use? We are using .5 mm pitch and have a no clean process. | I have been using lots of metal

To remove an AMP Mictor Connector

Electronics Forum | Wed Nov 14 20:30:26 EST 2001 | davef

Tks. So was the answer that you got close? [ala "Car Talk"] Some guy from Cal-fornie sends me spill. I get cigars from � Yeh, I know I hog the responses, but I learn by doing this. If I can communicate in print, I can better communicate in word

void on BGA Ball due to via on BGA pad

Electronics Forum | Fri Aug 16 10:00:03 EDT 2002 | davef

You have a very bad situation. It�s tough for the gas, flux material, er whatever to escape when the BGA is sitting on top of it and the blind via is blocking it from the other side. Obviously the vias should have been: * Placed on the edge of the

SMT Cell Layout

Electronics Forum | Sat Nov 20 09:29:36 EST 2004 | JB

You are not giving the dimensions of the space to be used by your machines. So it's impossible to know what we are working with. But here is scenario for a very small floor space assuming that you can't have the equipment in a single line: I am ass

Accuracy Requirements for New Technology

Electronics Forum | Fri Apr 08 16:26:36 EDT 2005 | Grant

Hi, It seems weird that an automated pick and place machine at a board shop would not be up to NASA standards, but placing the components by hand would be. However most SMT will self center a bit, so if your close enough, you should be ok. You rea

Stencil thickness

Electronics Forum | Thu Jun 09 13:30:34 EDT 2005 | PWH

I would suggest 7mm thick "Durostone" as a carrier material. Cut lip/pocket for PCB so it is 0.05" thinner than thickness of PCB. Allow 0.010" gap on all sides of PCB. Machine lip to width between 0.050" and 0.100" to support under perimeter sides


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