Electronics Forum: off (Page 436 of 542)

Re: electroformed stencils

Electronics Forum | Fri Jun 04 09:20:55 EDT 1999 | HST-SE

Al, We make stencils, and I was personally involved at AMTX when the electroformed process was developed. Some of this will sound like an ad, but everyone has been volunteering vendors and so look at this as a suggestion. Electroforming is an addit

Re: vibration during solder reflow

Electronics Forum | Fri May 21 15:23:24 EDT 1999 | JohnW

| | Has anyone had any experience or data using vibration during the reflow process. | | We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process work

Re: Lo Behold Voids!!!!

Electronics Forum | Thu May 20 22:42:19 EDT 1999 | Dave F

| hi everybody, | We've been doing some studies on assembly of CSPs. We assembled these packages on micrivia-in-pad patterns. These are 15/13.5/11 mil pads with 6 mil design microvia, using photo/laser/plasma tech. We are seeing voids, as big as the

Wes' question on VOC-FREE flux

Electronics Forum | Wed May 19 11:01:17 EDT 1999 | Vince Whipple

Wes, I have been involved with many customers changing over from an alcohol based no-clean to a VOC-free process. The change-over can be made easier by such things as air movement, convection preheat, "drains" or reliefs in pallets (if used), contr

Re: Exhausting of flux in reflow ovens

Electronics Forum | Fri May 14 00:16:28 EDT 1999 | Mike D.

| Does anyone know of any industry guidelines for the exhausting of volatiles in reflow ovens? I've seen some numbers like 1,000ppm for the oven atmosphere, but is this typical? | | My concern is the volatiles in my WS629 solder paste may be attack

Re: BGA's - Re-ball -- How thick?

Electronics Forum | Tue May 18 14:15:59 EDT 1999 | Scott McKee

| | What is the best way to re-ball a BGA? Who has the best system for doing it? | | | I'm using our SRT rework stuff to reball in house - when necessary. Of course, we only do this for protos and test boards. We use a standard micro-stencil, after

Re: VOC Free Flux

Electronics Forum | Wed May 12 17:37:08 EDT 1999 | Timothy O'Neill

| I am looking for anyone who has converted over to VOC Free flux. I need some info on any problems, etc. that you might have had. | | Please E-mail me at wes.ruggles@vickers-systems.com or call at (513) 494-5229 | | Thanks | Wes Ruggles | Hi Wes

Re: VOC Free Flux

Electronics Forum | Wed May 19 17:44:49 EDT 1999 | Vince Whipple

Wes, I have been involved with many customers changing over from an alcohol based no-clean to a VOC-free process. The change-over can be made easier by such things as air movement, convection preheat, "drains" or reliefs in pallets (if used), control

Re: Printing Adhesive

Electronics Forum | Wed May 05 23:26:29 EDT 1999 | Dean

| OK, my manager read an article on printing glue (aaargghh!)and wants to know why we aren't doing it. We currently use Fuji GLs and GDMs to dispense glue. I've never done it, but have seen it done at NEPCON and other shows. It looks OK, BUT what

Re: Printing Adhesive

Electronics Forum | Thu May 06 18:18:15 EDT 1999 | JohnW

| OK, my manager read an article on printing glue (aaargghh!)and wants to know why we aren't doing it. We currently use Fuji GLs and GDMs to dispense glue. I've never done it, but have seen it done at NEPCON and other shows. It looks OK, BUT what


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