Electronics Forum | Wed Feb 01 17:03:04 EST 2006 | grantp
Hi, What's the difference between soldering a lead free solder ball BGA onto a footprint with lead solder paste when the ball does not collapse, compared to a lead-less package. The BGA is bigger, but you rely on the solder paste only, seems to work
Electronics Forum | Thu Dec 08 22:15:46 EST 2005 | molosse21
Hi everyone, One of our customer is asking us wich one of these two components has a better resistance to vibration. Vibration can be a potential problem for them. He has the choice between a thru hole radial capacitor with near 0.400 in diameter an
Electronics Forum | Fri Dec 09 11:37:29 EST 2005 | Samir Nagaheenanajar
So, I'm workin' my damn fax machine; unfortunately, it's one of the 1st generation fax machines, because in Riyadh, we get stuck with the old equipment, and then it gives a message on the LCD display: Paper Jam..so I get mad, and yell: WHY DOES IT
Electronics Forum | Wed Dec 14 23:32:19 EST 2005 | jhernan9
Hi, I'm having a lot of problems with BGA's shorts, we are using 0.005" stencil aperture 1 to 1 (0.014)", the paste is centre (I can not measured the height)was verified using electronic microscopie, the placement is centre (I'm using local fiducials
Electronics Forum | Fri Dec 16 11:31:45 EST 2005 | fastek
Does this bring back some awful memories! Back in the mid-80's I worked for a little company called Solectron (yes they were small back then). They wanted everyone to wear smocks and I fought that one come hell and high water. It was all for show as
Electronics Forum | Thu Dec 22 16:12:51 EST 2005 | chunks
Off the Cuff Answer: Wow, nice big ugly connector! Thought we were the only ones using these things designed during the Korean war. Actually it really depends on the customers print. If they want conformal coating, they should know exactly where
Electronics Forum | Thu Feb 02 16:51:32 EST 2006 | fasst1
Greg, FYI, the concept of the Comet is that 1/2 of the board is populated on each table. This is in an effort to reduce the total transfer time hit per board. The on machine optimizer should be able to handle the split of the program. If you need
Electronics Forum | Thu Feb 09 10:29:37 EST 2006 | stepheniii
I worked at one place where they had a dishwasher. They had stopped using it by the time I got there. But if they had kept using it I would have gotten a clean glass and put it in to see how clean it came out. I think after a while with only one tan
Electronics Forum | Tue Mar 07 14:18:32 EST 2006 | James
Billy, I have to disagree with you. We inadvertently soldered a Pb BGA with SAC305 paste and then had it micro sectioned and spectrum analyzed. Imagine our surprise when we saw the spectrum analysis showed Pb. The micro sections showed none to ac
Electronics Forum | Tue Mar 28 17:10:25 EST 2006 | mikecollier
I unfortunately cannot post any photos, the unit in question is classified. And, as far as my comment that the BGA profile can be manipulated, if an engineer is also working the process with one of the operators, they can override the profile at any
