Electronics Forum | Thu Jun 23 10:36:04 EDT 2005 | stepheniii
I think the single most important thing will be to maintain positive pressure in the room. All the air filtering will not be able to keep up if dirt is blown into the room everytime a door is opened. The next would be to control as much as possible,
Electronics Forum | Fri Jul 15 13:58:32 EDT 2005 | seaK
Our production is putting QFN40 and QFN56 package on board. With 80% opening on terminal, 40% on thermal pad, we found QFN56 100% forming toe fillet, but it does not work out the same to QFN40. We suspect it's because of the weight of component.....
Electronics Forum | Thu Jun 30 09:55:32 EDT 2005 | slthomas
Is this happending consistently with every board? I guess if it is (so is easily reproduced), I'd run boards in with the lid down, then open it when the tunnel is full and see which boards still have all the parts in place. At least then you'll kno
Electronics Forum | Thu Jul 14 14:31:11 EDT 2005 | johnnie8
A customer has asked us to solder a surface mount mini USB connector to a board. They need the connector housing to center on an opening in a plastic panel. The question is how much does the solder process add to the overall height of the coonctor, e
Electronics Forum | Sun Sep 11 05:48:32 EDT 2005 | Mika
If 0 or 180 degr. make v-shape openings to each other left & riht, if 90 or 270 degr. top/ bottom, on the stencil apertures; well, you understand... We use this and 87 % reduction of stencil apertures for 0603:s and 0402:s. 0.127 mm stencil thicknes
Electronics Forum | Thu Sep 22 06:12:05 EDT 2005 | gavinscott
Hi All, I have been tasked with a project on the control of moisture sensitive devices and I was hoping to get some input from the experts out there... How do you monitor total exposure time for a MSD? If the packaging has been opened and re-sealed a
Electronics Forum | Thu Oct 20 06:03:23 EDT 2005 | Slaine
during the soldering process on larger BGAs the corners can bend up or down due the large copper heatsink on top expanding quicker than the material the bga is made out of, in the worst cases this can lead to to the balls lifting out of the paste and
Electronics Forum | Mon Dec 05 09:38:35 EST 2005 | rlackey
Surely not? I thought it was all free & we were heathens (at least I'm guessing that's what the cable guy insult was meant to mean)for not welcoming it with open arms. O well, back to my biggest technical problem of the next two weeks - what SPF r
Electronics Forum | Wed Dec 07 18:37:24 EST 2005 | russ
You need a thicker mask/stencil, the openings should be .005" larger than ball diameter and the thickness should also be .005" thicker than the ball diameter. by making the mask thicker you can then just roll or scrape the extra balls off and any d
Electronics Forum | Sat Dec 10 08:13:53 EST 2005 | davef
We believe imm tin suppliers say that their product does not whiskey, oops whisker, because they use 'white tin' not the 'gray tin' that causes whiskers. But as soon as you alloy their tin with SAC or any other high tin content solder, all bets are
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